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Component Integration
Component Integration
Component integration is the process of combining nanoscale components into functional systems or devices.
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List of available equipment
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Micro Transfer Printer- X Display (XDC) MTP
More information to come.
RMIT
VIC Node
Description
Thin (~10 microns) chips, dubbed x-chips, are lifted and transferred from donor wafers to CMOS or other target surfaces, providing wafer-level integration.
Related Information
More information to come.
Tool Contact
arnan.mitchell@rmit.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Micro Transfer Printer- X Display (XDC) MTP
More information to come.
RMIT
VIC Node
Description
Thin (~10 microns) chips, dubbed x-chips, are lifted and transferred from donor wafers to CMOS or other target surfaces, providing wafer-level integration.
Related Information
More information to come.
Tool Contact
arnan.mitchell@rmit.edu.au