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Cleaning
Cleaning
Cleaning, an essential step when operating on the micro and nanoscale, is used to remove contaminants from the surface of the substrate before it is used in another fabrication process.This sometimes means simply burning away material, often using an asher to do this. Ashers use heat to remove unwanted material, such as photoresist. They are often used to clean a wafer, although they can sometimes be used to selectively etch away material as well.
List of available equipment
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Custom Asher
Plasma asher
NSW Node
University of New South Wales
Description
O2 plasma asher
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
Denton Asher
Plasma asher
NSW Node
University of New South Wales
Description
O2 plasma asher
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
Harrick Plasma PDC-002
Plasma cleaner
QLD Node
University of Queensland
Description
For nanoscale surface cleaning and surface activation. Used when making a glass-PDMS or PDMS-PDMS microfluidic chip
Related Information
Provides an organic material etch rate of 5-10 nm/min
Tool Contact
anff@uq.edu.au
OEM Spin Rinse Dryer – Etch
Wafer Cleaning tool
NSW Node
University of Sydney
Description
Automated batch wafer cleaning tool
Related Information
Can accommodate up to 6 inch round wafers
Tool Contact
rpf.queries@sydney.edu.au
OEM Spin Rinse Dryer
Wafer Cleaning tool
NSW Node
University of Sydney
Description
Automated batch wafer cleaning tool
Related Information
Can accommodate up to 6 inch square wafers
Tool Contact
rpf.queries@sydney.edu.au
PlasmaTech V50
Plasma asher
SA Node
University of South Australia
Description
Used primarily for ashing photoresist materials from substrates.
Related Information
Used in the fabrication of microfluidic devices. The system can be also used be used for various other surface treatments.
Tool Contact
Simon.Doe@unisa.edu.au
Tepla Gigabatch 300
Plasma asher
ACT Node
Australian National University (ANU)
Description
Used to strip resist and clean samples.Useful during the fabrication of photovoltaic, optoelectronic or nano-photonic technologies as a vital part of the complete lithography process.
Related Information
Available gases include O2 and CF4. The system is suitable to remove organic/polymers but also dielectrics including SiOx
Tool Contact
horst.punzmann@anu.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Custom Asher
Plasma asher
ACT Node
Australian National University (ANU)
Description
O2 plasma asher
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Denton Asher
Plasma asher
ACT Node
Australian National University (ANU)
Description
O2 plasma asher
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Harrick Plasma PDC-002
Plasma cleaner
ACT Node
Australian National University (ANU)
Description
For nanoscale surface cleaning and surface activation. Used when making a glass-PDMS or PDMS-PDMS microfluidic chip
Related Information
Provides an organic material etch rate of 5-10 nm/min
Tool Contact
anff@uq.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
OEM Spin Rinse Dryer – Etch
Wafer Cleaning tool
ACT Node
Australian National University (ANU)
Description
Automated batch wafer cleaning tool
Related Information
Can accommodate up to 6 inch round wafers
Tool Contact
rpf.queries@sydney.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
OEM Spin Rinse Dryer
Wafer Cleaning tool
ACT Node
Australian National University (ANU)
Description
Automated batch wafer cleaning tool
Related Information
Can accommodate up to 6 inch square wafers
Tool Contact
rpf.queries@sydney.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
PlasmaTech V50
Plasma asher
ACT Node
Australian National University (ANU)
Description
Used primarily for ashing photoresist materials from substrates.
Related Information
Used in the fabrication of microfluidic devices. The system can be also used be used for various other surface treatments.
Tool Contact
Simon.Doe@unisa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Tepla Gigabatch 300
Plasma asher
ACT Node
Australian National University (ANU)
Description
Used to strip resist and clean samples.Useful during the fabrication of photovoltaic, optoelectronic or nano-photonic technologies as a vital part of the complete lithography process.
Related Information
Available gases include O2 and CF4. The system is suitable to remove organic/polymers but also dielectrics including SiOx
Tool Contact
horst.punzmann@anu.edu.au