Cleaning
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Cleaning

Cleaning, an essential step when operating on the micro and nanoscale, is used to remove contaminants from the surface of the substrate before it is used in another fabrication process. This sometimes means simply burning away material, often using an asher to do this. Ashers use heat to remove unwanted material, such as photoresist. They are often used to clean a wafer, although they can sometimes be used to selectively etch away material as well.

List of available equipment
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
AlphaPlasma Q235 Asher
More information to come.
NSW Node University of New South Wales
Description
Microwave plasma asher
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
Custom Asher
Plasma asher
NSW Node University of New South Wales
Description
O2 plasma asher
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
Denton Asher
Plasma asher
NSW Node University of New South Wales
Description
O2 plasma asher
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
Electrocleaning DigitalMatrix PMT
More information to come.
Melbourne Centre for Nanofabrication VIC Node
Description
It is an instrument for electrocleaning and passivation layer formation which is one of the the process steps for fabricating a copy of the Master mould (Ni shim). Passivation layer will make it easy for separation/un-zipping of the two Ni metal shims after electroforming.
Related Information
The instrument uses highly alkalline based electrolyte and runs automated electrocleaning and passivation anodic/cathodic cycles to clean the sample surface first to form a passivating thin oxide layer.
Tool Contact
mcn-enquiries@nanomelbourne.com
OEM Spin Rinse Dryer – Etch
Wafer Cleaning tool
NSW Node University of Sydney
Description
Automated batch wafer cleaning tool
Related Information
Can accommodate up to 6 inch round wafers
Tool Contact
rpf.queries@sydney.edu.au
OEM Spin Rinse Dryer
Wafer Cleaning tool
NSW Node University of Sydney
Description
Automated batch wafer cleaning tool
Related Information
Can accommodate up to 6 inch square wafers
Tool Contact
rpf.queries@sydney.edu.au
Plasma Asher- PlasmaTech V50
Plasma asher
SA Node University of South Australia
Description
Used primarily for ashing photoresist materials from substrates.
Related Information
Used in the fabrication of microfluidic devices. The system can be also used be used for various other surface treatments.
Tool Contact
Simon.Doe@unisa.edu.au
Plasma cleaner- Harrick Plasma PDC-002
Plasma cleaner
QLD Node University of Queensland
Description
For nanoscale surface cleaning and surface activation. Used when making a glass-PDMS or PDMS-PDMS microfluidic chip
Related Information
Provides an organic material etch rate of 5-10 nm/min
Tool Contact
anff@uq.edu.au
Tepla Gigabatch 300
Plasma asher
ACT Node Australian National University (ANU)
Description
Used to strip resist and clean samples.Useful during the fabrication of photovoltaic, optoelectronic or nano-photonic technologies as a vital part of the complete lithography process.
Related Information
Available gases include O2 and CF4. The system is suitable to remove organic/polymers but also dielectrics including SiOx
Tool Contact
horst.punzmann@anu.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
AlphaPlasma Q235 Asher
More information to come.
ACT Node Australian National University (ANU)
Description
Microwave plasma asher
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Custom Asher
Plasma asher
ACT Node Australian National University (ANU)
Description
O2 plasma asher
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Denton Asher
Plasma asher
ACT Node Australian National University (ANU)
Description
O2 plasma asher
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Electrocleaning DigitalMatrix PMT
More information to come.
ACT Node Australian National University (ANU)
Description
It is an instrument for electrocleaning and passivation layer formation which is one of the the process steps for fabricating a copy of the Master mould (Ni shim). Passivation layer will make it easy for separation/un-zipping of the two Ni metal shims after electroforming.
Related Information
The instrument uses highly alkalline based electrolyte and runs automated electrocleaning and passivation anodic/cathodic cycles to clean the sample surface first to form a passivating thin oxide layer.
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
OEM Spin Rinse Dryer – Etch
Wafer Cleaning tool
ACT Node Australian National University (ANU)
Description
Automated batch wafer cleaning tool
Related Information
Can accommodate up to 6 inch round wafers
Tool Contact
rpf.queries@sydney.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
OEM Spin Rinse Dryer
Wafer Cleaning tool
ACT Node Australian National University (ANU)
Description
Automated batch wafer cleaning tool
Related Information
Can accommodate up to 6 inch square wafers
Tool Contact
rpf.queries@sydney.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Plasma Asher- PlasmaTech V50
Plasma asher
ACT Node Australian National University (ANU)
Description
Used primarily for ashing photoresist materials from substrates.
Related Information
Used in the fabrication of microfluidic devices. The system can be also used be used for various other surface treatments.
Tool Contact
Simon.Doe@unisa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Plasma cleaner- Harrick Plasma PDC-002
Plasma cleaner
ACT Node Australian National University (ANU)
Description
For nanoscale surface cleaning and surface activation. Used when making a glass-PDMS or PDMS-PDMS microfluidic chip
Related Information
Provides an organic material etch rate of 5-10 nm/min
Tool Contact
anff@uq.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Tepla Gigabatch 300
Plasma asher
ACT Node Australian National University (ANU)
Description
Used to strip resist and clean samples.Useful during the fabrication of photovoltaic, optoelectronic or nano-photonic technologies as a vital part of the complete lithography process.
Related Information
Available gases include O2 and CF4. The system is suitable to remove organic/polymers but also dielectrics including SiOx
Tool Contact
horst.punzmann@anu.edu.au

    Acknowledgement of Country

    ANFF acknowledges the Traditional Owners of Country throughout Australia and pays respect to Elders past and present. We also acknowledge the First Nations people of Australia as engineers and scientists in whose tradition and footsteps we aspire to follow.

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