Deep Reactive Ion Etching (DRIE)
Deep Reactive Ion Etching (DRIE)
Deep Reactive Ion Etching (DRIE) is effectively an extension of the Reactive Ion Etching (RIE) process, but can provide higher aspect ratio structures. The DRIE process alternates between etch and passivation cycles to allow patterns to be cut deeper into a substrate. Etch channels or other feature geometries with extremely high uniformity into glass, plastic or silicon substrates
List of available equipment
TOOL MAKE AND MODEL
LOCATION
Deep reactive ion etcher (DRIE) Etcher, Plasma Therm Versaline
ANFF QLD UQ - AIBN
Deep Reactive Ion Etcher, Ulvac NLD-570
ANFF SA
ICP/RIE, Multi-etch system
ANFF VIC MCN
ICP/RIE, Silicon-specific dry etching
ANFF VIC MCN
ICP-RIE System, SAMCO
ANFF VIC MCN
NLD RIE, Si/SiO2
ANFF VIC MCN