Microcontact/transfer printing
Microcontact/transfer printing
Microcontact printing (µCP) and microtransfer printing are advanced techniques used to create precise patterns and structures at the micro and nanoscale. These methods are part of the broader category of soft lithography, which utilises elastomeric stamps to transfer materials onto substrates.
List of available equipment
TOOL MAKE AND MODEL
LOCATION
Micro Transfer Printer, X Display (XDC) MTP
ANFF VIC RMIT
TOOL MAKE AND MODEL
LOCATION
Micro Transfer Printer, X Display (XDC) MTP
The MTP printer enables micro-scale integration of semiconductor devices or integrated circuits (ICs) onto non-native substrates. It helps relieve the process bottleneck of heterogeneous integration of non-silicon devices and silicon integrated circuits in More-than-Moore application and for printing high-performance micro-scale device arrays onto plastic substrates in printed and flexible electronics applications.
Description
Thin (~10 microns) x-chips are lifted from donor wafers and transferred to CMOS or other target surfaces for wafer-level integration. This advanced system, designed for high-precision mass transfer of micro-scale devices like microLEDs, uses elastomer stamps for the parallel assembly of millions of devices with outstanding accuracy and efficiency. It supports scalable manufacturing for display technology, semiconductors, and advanced electronics.
Related Information
Stage Max Travel (X x Y mm): 200 x 200, 3-sigma Std. Deviation MA (Medium Array [~500]): < 1.0um SA (Small Array [ < 100 ]): < 0.75um SPS (Single Post Stamp [1]): < 0.5um
Tool Contact
mnrf@rmit.edu.au