PA-ALD, also known as Plasma-Enhanced ALD (PEALD), incorporates plasma into the ALD process. Plasma is a highly energised state of matter containing ions, electrons, and neutral particles. By using plasma, PA-ALD enhances the reactivity of precursors, allowing deposition at lower temperatures. This is particularly useful for substrates that cannot tolerate high thermal budgets, such as polymers or temperature-sensitive electronic components. PA-ALD also enables the deposition of films with tailored properties, such as improved hardness, conductivity, or optical characteristics