Spin coating and wafer development
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Spin coating and wafer development

Spin coaters are capable of applying uniform thickness polymer films, such as a resist to substrates. Resist is essential for many types of lithography, such as UV lithography. Resists are termed either positive or negative — this denotes whether, when cured, chemical bonds are made or broken, and therefore whether the sections of resist that remain are either the true pattern, or it’s inverse. This selection must be considering etching or deposition stages that may follow as it will help to make.

List of available equipment
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Coater and develoer system- Picotrack
Spin coater and developer
NSW Node University of Sydney
Description
A fully automated system for spin coating, HMDS application, baking, and development. The system is well suited to batch scale production, providing high process performance and consistency in coating and development.
Related Information
The system can process 4 and 6 inch wafers, and is capable of running 25 wafers at a time. Auto dispense of resist (standard SPR660). MF26 developer.
Tool Contact
rpf.queries@sydney.edu.au
Coating and developing- SVG 8600 Series
Photoresist coating and developing Tool
Australian National University (ANU) Optofab Node
Description
The Silicon Valley Group 8600 series lithography track is a fully automated H bar cassette to cassette photoresist coat and develop system for wafers from 50mm to 150mm diameter. It has a single high resolution I line positive resist permanently plumbed in (Clariant AZ MiR 701) with an automated dispense arm, a pressurized canister dispense for adhesion promoter, and a positive displacement syringe pump style dispense to enable coating of any other type of resist or dielectric spin on coat.
Related Information
Spin speed:50 rpm to 10,000 rpm, run up to 10 steps in a process,wafer capability 4 inch
Tool Contact
stephen.madden@anu.edu.au
Combination Spinner/Hotplate
More information to come.
Melbourne Centre for Nanofabrication VIC Node
Description
High uniformity coating of 4 inch wafers with photoresist, with hotplate attached
Related Information
More information to come.
Tool Contact
mcn-enquiries@nanomelbourne.com
EVG 105 Bake Module
Photolithography thermal curing
University of Western Australia WA Node
Description
Softbake, post-exposure bake and hardbake processes. Programmable proximity pins and nitrogen overflow provide control of resist hardening processes and temperature profiles.
Related Information
Process up to 300 mm wafer sizes or up to four 100 mm wafers at the same time
Tool Contact
anff-wa@uwa.edu.au
HG Programmable Hotplate
More information to come.
Melbourne Centre for Nanofabrication VIC Node
Description
Programmable hotplate, 3 programmes, 5 ramps.
Related Information
High temperature titanium hotplate up to 600°C, 230V, without regulator, antimagnetic and rustproof, 2000W, plate size 280x200 mm, with cover
Tool Contact
mcn-enquiries@nanomelbourne.com
Laminator Sky 325R6
More information to come.
Melbourne Centre for Nanofabrication VIC Node
Description
Laminator with programmable temperature and speed control.
Related Information
The SKY laminator is used to apply SU8 dry films, to silicon wafers. These films are thicknesses ranging from 100 µm to more than 500 µm, and are thus a preferred alternative to spinning thick films of liquid SU8 resist.
Tool Contact
mcn-enquiries@nanomelbourne.com
Lithography Track System
Automated spin-coating and wafer developing system
Melbourne Centre for Nanofabrication VIC Node
Description
A fully automated system for wafer processing which includes spin coating, HMDS application, baking, and development.The system is well suited to batch scale production, providing high process performance and consistency in coating and development.
Related Information
Substrate size - 4 and 6 inch wafers. Batch process size - up to 25 wafers at a time. Resist system used - AZ 1512 and AZ 4562 photoresists to coat wafers and AZ 400K for development.
Tool Contact
mcn-enquiries@nanomelbourne.com
Pico Track Automatic spin coater and developer
More information to come.
Melbourne Centre for Nanofabrication VIC Node
Description
PCT-150RRE is capable of running wafer sizes of 4 inch and 6 inch diameter with no change-over requirements. Comprised of numerous spin modules, the system can adapt to virtually all photolithography processes with precision and produce patterned wafers with extremely high uniformity. The track system automates all steps continuously including adhesion promoter, pre-baking, resist coating, edge-bead removal (EBR), development, and post-baking.
Related Information
More information to come.
Tool Contact
mcn-enquiries@nanomelbourne.com
Spin Coater- Laurell WS-400A
Spin coater for ink coatings
Materials Node University of Newcastle
Description
Used to produce thin films on small substrates. The sample is placed onto a vacuum chuck and rotated at thousands of revolutions per minute whilst ink is deposited onto the surface. The majority of the ink is removed due to the rotation but what's left is an extremely thin, uniform film.
Related Information
Typical sample sizes are 1-2 cm2. Speeds from 200 to 8000 rpm are possible.
Tool Contact
anff@newcastle.edu.au
Spin coater- Polos Spin 150i NPP_1
More information to come.
QLD Node University of Queensland
Description
Coating SU-8 on the silicon wafer for the SU-8 wafer fabrication
Related Information
More information to come.
Tool Contact
anff@uq.edu.au
Spin coater- Polos Spin 150i NPP
More information to come.
QLD Node University of Queensland
Description
Coating PDMS on the glass slides for PDMS device fabrication
Related Information
More information to come.
Tool Contact
anff@uq.edu.au
Spin coater- SSE OPTIcoat ST22+
Resist developer
Griffith University QLD Node
Description
Uses a vacuum chuck to spin the wafer whilst a specific amount of photoresist is deposited on the surface of the substrate. Spin speeds and volumes are variable to allow for different thickness and uniformity requirements.
Related Information
An essential part of photolithography.
Tool Contact
glenn.walker@griffith.edu.au
Spin coater- SSE OPTIspin SST20
More information to come.
Griffith University QLD Node
Description
Resist coater + hot plate
Related Information
More information to come.
Tool Contact
glenn.walker@griffith.edu.au
Spin Coater- Suss Delta 80
Spin coater
SA Node University of South Australia
Description
This is a spin coater, which is used in micro- and nanofabrication processes to apply thin uniform films of photoresist, polymeric coatings or other materials onto a substrate using spin coating technique.
Related Information
Capable of applying uniform thickness polymer films, such as a resist to substrates a “Gyrset” to help achieve uniformity, especially on square and rectangular substrates and to minimise edge bead build up.
Tool Contact
ANFF-SA@unisa.edu.au
Spin/Spray Coater- EVG 101
Spin and spray coating
SA Node University of South Australia
Description
This is a spin and spray coater, which is used in micro- and nanofabrication processes to apply thin uniform films of photoresist, polymeric coatings or other materials onto a substrate using spin or spray coating technique.
Related Information
Capable of applying uniform thickness polymer films, such as a resist to substrates a “Gyrset” to help achieve uniformity, especially on square and rectangular substrates and to minimise edge bead build up.
Tool Contact
ANFF-SA@unisa.edu.au
Spinner SUSS 6 inch wafer
More information to come.
Melbourne Centre for Nanofabrication VIC Node
Description
High uniformity coating of 6 inch wafers with photoresist
Related Information
More information to come.
Tool Contact
mcn-enquiries@nanomelbourne.com
Suss Delta RC80+ Spin Coater
Spin coater
Melbourne Centre for Nanofabrication VIC Node
Description
Spin coater set up to process 4-inch wafers and also features a hot plate.
Related Information
high uniformity spin coater.
Tool Contact
mcn-enquiries@nanomelbourne.com
Suss RC8 Gyrosett Spinner
Spin coater
RMIT VIC Node
Description
Spin coater
Related Information
Wafer size: Pieces and up to 4 inch wafers; Spin speed: 6000RPM (based on a ø100mm silicon wafer).
Tool Contact
arnan.mitchell@rmit.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Coater and develoer system- Picotrack
Spin coater and developer
NSW Node University of Sydney
Description
A fully automated system for spin coating, HMDS application, baking, and development. The system is well suited to batch scale production, providing high process performance and consistency in coating and development.
Related Information
The system can process 4 and 6 inch wafers, and is capable of running 25 wafers at a time. Auto dispense of resist (standard SPR660). MF26 developer.
Tool Contact
rpf.queries@sydney.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Coating and developing- SVG 8600 Series
Photoresist coating and developing Tool
Australian National University (ANU) Optofab Node
Description
The Silicon Valley Group 8600 series lithography track is a fully automated H bar cassette to cassette photoresist coat and develop system for wafers from 50mm to 150mm diameter. It has a single high resolution I line positive resist permanently plumbed in (Clariant AZ MiR 701) with an automated dispense arm, a pressurized canister dispense for adhesion promoter, and a positive displacement syringe pump style dispense to enable coating of any other type of resist or dielectric spin on coat.
Related Information
Spin speed:50 rpm to 10,000 rpm, run up to 10 steps in a process,wafer capability 4 inch
Tool Contact
stephen.madden@anu.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Combination Spinner/Hotplate
More information to come.
Melbourne Centre for Nanofabrication VIC Node
Description
High uniformity coating of 4 inch wafers with photoresist, with hotplate attached
Related Information
More information to come.
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
EVG 105 Bake Module
Photolithography thermal curing
University of Western Australia WA Node
Description
Softbake, post-exposure bake and hardbake processes. Programmable proximity pins and nitrogen overflow provide control of resist hardening processes and temperature profiles.
Related Information
Process up to 300 mm wafer sizes or up to four 100 mm wafers at the same time
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
HG Programmable Hotplate
More information to come.
Melbourne Centre for Nanofabrication VIC Node
Description
Programmable hotplate, 3 programmes, 5 ramps.
Related Information
High temperature titanium hotplate up to 600°C, 230V, without regulator, antimagnetic and rustproof, 2000W, plate size 280x200 mm, with cover
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Laminator Sky 325R6
More information to come.
Melbourne Centre for Nanofabrication VIC Node
Description
Laminator with programmable temperature and speed control.
Related Information
The SKY laminator is used to apply SU8 dry films, to silicon wafers. These films are thicknesses ranging from 100 µm to more than 500 µm, and are thus a preferred alternative to spinning thick films of liquid SU8 resist.
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Lithography Track System
Automated spin-coating and wafer developing system
Melbourne Centre for Nanofabrication VIC Node
Description
A fully automated system for wafer processing which includes spin coating, HMDS application, baking, and development.The system is well suited to batch scale production, providing high process performance and consistency in coating and development.
Related Information
Substrate size - 4 and 6 inch wafers. Batch process size - up to 25 wafers at a time. Resist system used - AZ 1512 and AZ 4562 photoresists to coat wafers and AZ 400K for development.
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Pico Track Automatic spin coater and developer
More information to come.
Melbourne Centre for Nanofabrication VIC Node
Description
PCT-150RRE is capable of running wafer sizes of 4 inch and 6 inch diameter with no change-over requirements. Comprised of numerous spin modules, the system can adapt to virtually all photolithography processes with precision and produce patterned wafers with extremely high uniformity. The track system automates all steps continuously including adhesion promoter, pre-baking, resist coating, edge-bead removal (EBR), development, and post-baking.
Related Information
More information to come.
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Spin Coater- Laurell WS-400A
Spin coater for ink coatings
Materials Node University of Newcastle
Description
Used to produce thin films on small substrates. The sample is placed onto a vacuum chuck and rotated at thousands of revolutions per minute whilst ink is deposited onto the surface. The majority of the ink is removed due to the rotation but what's left is an extremely thin, uniform film.
Related Information
Typical sample sizes are 1-2 cm2. Speeds from 200 to 8000 rpm are possible.
Tool Contact
anff@newcastle.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Spin coater- Polos Spin 150i NPP_1
More information to come.
QLD Node University of Queensland
Description
Coating SU-8 on the silicon wafer for the SU-8 wafer fabrication
Related Information
More information to come.
Tool Contact
anff@uq.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Spin coater- Polos Spin 150i NPP
More information to come.
QLD Node University of Queensland
Description
Coating PDMS on the glass slides for PDMS device fabrication
Related Information
More information to come.
Tool Contact
anff@uq.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Spin coater- SSE OPTIcoat ST22+
Resist developer
Griffith University QLD Node
Description
Uses a vacuum chuck to spin the wafer whilst a specific amount of photoresist is deposited on the surface of the substrate. Spin speeds and volumes are variable to allow for different thickness and uniformity requirements.
Related Information
An essential part of photolithography.
Tool Contact
glenn.walker@griffith.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Spin coater- SSE OPTIspin SST20
More information to come.
Griffith University QLD Node
Description
Resist coater + hot plate
Related Information
More information to come.
Tool Contact
glenn.walker@griffith.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Spin Coater- Suss Delta 80
Spin coater
SA Node University of South Australia
Description
This is a spin coater, which is used in micro- and nanofabrication processes to apply thin uniform films of photoresist, polymeric coatings or other materials onto a substrate using spin coating technique.
Related Information
Capable of applying uniform thickness polymer films, such as a resist to substrates a “Gyrset” to help achieve uniformity, especially on square and rectangular substrates and to minimise edge bead build up.
Tool Contact
ANFF-SA@unisa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Spin/Spray Coater- EVG 101
Spin and spray coating
SA Node University of South Australia
Description
This is a spin and spray coater, which is used in micro- and nanofabrication processes to apply thin uniform films of photoresist, polymeric coatings or other materials onto a substrate using spin or spray coating technique.
Related Information
Capable of applying uniform thickness polymer films, such as a resist to substrates a “Gyrset” to help achieve uniformity, especially on square and rectangular substrates and to minimise edge bead build up.
Tool Contact
ANFF-SA@unisa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Spinner SUSS 6 inch wafer
More information to come.
Melbourne Centre for Nanofabrication VIC Node
Description
High uniformity coating of 6 inch wafers with photoresist
Related Information
More information to come.
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Suss Delta RC80+ Spin Coater
Spin coater
Melbourne Centre for Nanofabrication VIC Node
Description
Spin coater set up to process 4-inch wafers and also features a hot plate.
Related Information
high uniformity spin coater.
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Suss RC8 Gyrosett Spinner
Spin coater
RMIT VIC Node
Description
Spin coater
Related Information
Wafer size: Pieces and up to 4 inch wafers; Spin speed: 6000RPM (based on a ø100mm silicon wafer).
Tool Contact
arnan.mitchell@rmit.edu.au

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