Wafer dicing
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Wafer dicing

Nanofabricated devices are generally made in batches on wafers and need to be separated or packaged before use. This separation can be achieved through wet or dry dicing. In a wet dicing operation, a precision, high-speed, diamond impregnated blade is used to mill narrow grooves between the devices either partially or completely through the wafer. During this process, water is circulated over the cutting surface to cool the blade and prevent the liberation of dangerous particulates into the air. Materials which would be damaged by water are diced using a dry process known as scribing. Scribing utilises a diamond tipped stylus which is drawn across the wafer surface creating lines of high-stress which are later broken over precision fulcrum.

List of available equipment
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Dicing Saw- ADT Provectus 7100
Wafer dicer
QLD Node University of Queensland
Description
Fully programmable dicing saw capable of dicing up to 8 inch wafers.
Related Information
Provides high precision dicing, best performing matrix for hard, brittle and composite materials. Can dice hard and thick materials. Saw blade minimal width of 20 µm. Axis resolution in Y of 200 nm and Z of 200nm. Speed up to 350 mm/s.
Tool Contact
anff@uq.edu.au
Dicing saw- Disco DAD 3240
Automatic dicing saw
University of Western Australia WA Node
Description
Dices semiconductor sample wafers
Related Information
Adoption of a 1.8 kW high-output spindle enables the processing of a wide range of materials from silicon to difficult-to-process materials like ceramics.
Tool Contact
anff-wa@uwa.edu.au
Femtosecond Laser System
More information to come.
Melbourne Centre for Nanofabrication VIC Node
Description
fs-Carbide laser with 40W power, 3 wavelengths; 343nm, 515nm and 1030nm
Related Information
These systems generate laser pulses with durations on the order of femtoseconds (10^-15 seconds), enabling precise control over laser interactions with matter at extremely short timescales. Femtosecond lasers are utilized for a wide range of applications including micromachining, spectroscopy, nonlinear optics, and ultrafast imaging, among others.
Tool Contact
mcn-enquiries@nanomelbourne.com
MTI Saw
Diamond wire saw and Wafer Saw
Macquarie University Optofab Node
Description
Diamond wire saw and Wafer Saw for preparing small samples of glass from ingots or wafers
Related Information
Typical prepares 10-40mm areas samples of glass for photonic inscription
Tool Contact
benjamin.johnston@mq.edu.au
Suss scriber
Wafer scriber
NSW Node University of New South Wales
Description
wafer scriber
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
Wafer Dicer- Disco DAD 321
Wafer dicer
SA Node University of South Australia
Description
Wafer dicer capable of dicing 6-inch wafers
Related Information
The DISCO DAD 321 dicing saw uses a rotating ultra-thin diamond impregnated blade, in a wet environment, to cut materials such as silicon wafers, III-V semiconductors, glass sheets, ceramic, etc. into almost any shapes with straight edges. Cutting process is controlled automatically through software recipe programming. The machine is also capable of accurate, multi-directional on-screen semiautomatic alignment.
Tool Contact
Simon.Doe@unisa.edu.au
Wafer Dicing Saw
More information to come.
Melbourne Centre for Nanofabrication VIC Node
Description
The DAD3350 is capable of handling a maximum size of 8in diameter substrate and a maximum thickness of 5mm. The dicing saw is also capable of performing circle cut, trimming down circular shape samples and chopper cut During this process, water is circulated over the cutting surface to cool the blade and prevent the liberation of dangerous particulates into the air.
Related Information
A precision, high-speed, diamond impregnated blade is used to mill narrow grooves between the devices either partially or completely through the wafer.
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Dicing Saw- ADT Provectus 7100
Wafer dicer
Melbourne Centre for Nanofabrication VIC Node
Description
Fully programmable dicing saw capable of dicing up to 8 inch wafers.
Related Information
Provides high precision dicing, best performing matrix for hard, brittle and composite materials. Can dice hard and thick materials. Saw blade minimal width of 20 µm. Axis resolution in Y of 200 nm and Z of 200nm. Speed up to 350 mm/s.
Tool Contact
anff@uq.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Dicing saw- Disco DAD 3240
Automatic dicing saw
Melbourne Centre for Nanofabrication VIC Node
Description
Dices semiconductor sample wafers
Related Information
Adoption of a 1.8 kW high-output spindle enables the processing of a wide range of materials from silicon to difficult-to-process materials like ceramics.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Femtosecond Laser System
More information to come.
Melbourne Centre for Nanofabrication VIC Node
Description
fs-Carbide laser with 40W power, 3 wavelengths; 343nm, 515nm and 1030nm
Related Information
These systems generate laser pulses with durations on the order of femtoseconds (10^-15 seconds), enabling precise control over laser interactions with matter at extremely short timescales. Femtosecond lasers are utilized for a wide range of applications including micromachining, spectroscopy, nonlinear optics, and ultrafast imaging, among others.
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
MTI Saw
Diamond wire saw and Wafer Saw
Melbourne Centre for Nanofabrication VIC Node
Description
Diamond wire saw and Wafer Saw for preparing small samples of glass from ingots or wafers
Related Information
Typical prepares 10-40mm areas samples of glass for photonic inscription
Tool Contact
benjamin.johnston@mq.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Suss scriber
Wafer scriber
Melbourne Centre for Nanofabrication VIC Node
Description
wafer scriber
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Wafer Dicer- Disco DAD 321
Wafer dicer
Melbourne Centre for Nanofabrication VIC Node
Description
Wafer dicer capable of dicing 6-inch wafers
Related Information
The DISCO DAD 321 dicing saw uses a rotating ultra-thin diamond impregnated blade, in a wet environment, to cut materials such as silicon wafers, III-V semiconductors, glass sheets, ceramic, etc. into almost any shapes with straight edges. Cutting process is controlled automatically through software recipe programming. The machine is also capable of accurate, multi-directional on-screen semiautomatic alignment.
Tool Contact
Simon.Doe@unisa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Wafer Dicing Saw
More information to come.
Melbourne Centre for Nanofabrication VIC Node
Description
The DAD3350 is capable of handling a maximum size of 8in diameter substrate and a maximum thickness of 5mm. The dicing saw is also capable of performing circle cut, trimming down circular shape samples and chopper cut During this process, water is circulated over the cutting surface to cool the blade and prevent the liberation of dangerous particulates into the air.
Related Information
A precision, high-speed, diamond impregnated blade is used to mill narrow grooves between the devices either partially or completely through the wafer.
Tool Contact
mcn-enquiries@nanomelbourne.com