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Bonding and annealing
Bonding and annealing
Annealing is a process that can reduce residual stress in a substrate that has accumulated during prior processes such as deposition.The material is heated to high temperatures and allowed to cool at a controlled rate. This allows the material’s crystal structure to relax into a less intrinsically stressed state, and to settle into a more desirable microstructure as it cools.
List of available equipment
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
R.D. Webb Red Devil
Vacuum Furnace
SA Node
University of South Australia
Description
High temperature (1,200°C) vacuum or inert gas furnace for bonding and heat treatments.
Related Information
Commonly used for microfluidic devices, or during production of small high-value components.
Tool Contact
Simon.Doe@unisa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
R.D. Webb Red Devil
Vacuum Furnace
SA Node
University of South Australia
Description
High temperature (1,200°C) vacuum or inert gas furnace for bonding and heat treatments.
Related Information
Commonly used for microfluidic devices, or during production of small high-value components.
Tool Contact
Simon.Doe@unisa.edu.au