Component Integration
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Component Integration

Component integration is the process of combining nanoscale components into functional systems or devices.

List of available equipment
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Micro Transfer Printer- X Display (XDC) MTP
More information to come.
RMIT VIC Node
Description
Thin (~10 microns) chips, dubbed x-chips, are lifted and transferred from donor wafers to CMOS or other target surfaces, providing wafer-level integration.
Related Information
More information to come.
Tool Contact
arnan.mitchell@rmit.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Micro Transfer Printer- X Display (XDC) MTP
More information to come.
RMIT VIC Node
Description
Thin (~10 microns) chips, dubbed x-chips, are lifted and transferred from donor wafers to CMOS or other target surfaces, providing wafer-level integration.
Related Information
More information to come.
Tool Contact
arnan.mitchell@rmit.edu.au

    Acknowledgement of Country

    ANFF acknowledges the Traditional Owners of Country throughout Australia and pays respect to Elders past and present. We also acknowledge the First Nations people of Australia as engineers and scientists in whose tradition and footsteps we aspire to follow.

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