Component Integration
Component Integration
Component integration is the process of combining nanoscale components into functional systems or devices.
List of available equipment
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Micro Transfer Printer- X Display (XDC) MTP
More information to come.
RMIT
VIC Node
Description
Thin (~10 microns) chips, dubbed x-chips, are lifted and transferred from donor wafers to CMOS or other target surfaces, providing wafer-level integration.
Related Information
More information to come.
Tool Contact
arnan.mitchell@rmit.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Micro Transfer Printer- X Display (XDC) MTP
More information to come.
RMIT
VIC Node
Description
Thin (~10 microns) chips, dubbed x-chips, are lifted and transferred from donor wafers to CMOS or other target surfaces, providing wafer-level integration.
Related Information
More information to come.
Tool Contact
arnan.mitchell@rmit.edu.au