The NanoScribe Photic Professional GT2 (PPGT2) is a direct laser lithography system that uses two-photon polymerisation for additive 3D printing. A focal spot volume is defined by an IR femtosecond laser that concentrates light pulses and within this volume polymerisation occurs. The X-, Y- and Z-coordinate of a CAD model is defined by a focal spot volume, allowing for a CAD design to be printed as a 3D nanostructure layer-by-layer.

Two-photon polymerisation is based on the principle of photopolymerisation. Here, targeted exposure to light triggers the polymerisation, or the process to bring monomers together to create a polymer chain, of synthetic resins. This chain reaction causes the molecules to bond and harden, resulting in 3D models.

This equipment offers the possibility to work with one or two writing lasers, to be focused into one to two beam sizes ranging from 1µm to 50 µm. Writes over a surface area as large as 6 x 6 inches.

Used for direct write rapid prototyping and mask fabrication. Writing is possible on any type of substrate, including: photomasks, semiconductors, glass, polymers, crystals, flexible films. Direct laser lithography system

Direct write laser lithography system capable of high resolution and grayscale patterning

375 nm laser wavelength, multiple write modes. Capable of achieving sub 500 nm features with highest resolution, alignment, maximum write area 200 x 200 mm Direct laser lithography system

The Heidelberg MLA150 is an advanced maskless aligner designed for direct-write laser lithography. It is ideal for research and development, rapid prototyping, and small production volumes. The MLA150 eliminates the need for traditional photomasks by directly writing the design onto the photoresist-coated substrate using a laser. This approach significantly reduces cycle times and allows for quick design modifications by simply changing the CAD layout.

The ubstrate size is 6” x 6” with a max. write area 150 x 150 mm², substrate thickness 0.1 to 12 mm, laser wavelength 375 nm providing a min. feature size of 1 μm.

The Heidelberg MLA150 is an advanced maskless aligner designed for direct-write laser lithography. It is ideal for research and development, rapid prototyping, and small production volumes. The MLA150 eliminates the need for traditional photomasks by directly writing the design onto the photoresist-coated substrate using a laser. This approach significantly reduces cycle times and allows for quick design modifications by simply changing the CAD layout.

The design is loaded in GDS2 format which controls the stage movement and pixel exposure.

The Heidelberg MLA150 is an advanced maskless aligner designed for direct-write laser lithography. It is ideal for research and development, rapid prototyping, and small production volumes. The MLA150 eliminates the need for traditional photomasks by directly writing the design onto the photoresist-coated substrate using a laser. This approach significantly reduces cycle times and allows for quick design modifications by simply changing the CAD layout.

The Heidelberg MLA150 is an advanced maskless aligner designed for direct-write laser lithography. It is ideal for research and development, rapid prototyping, and small production volumes. The MLA150 eliminates the need for traditional photomasks by directly writing the design onto the photoresist-coated substrate using a laser. This approach significantly reduces cycle times and allows for quick design modifications by simply changing the CAD layout.

Used for direct write rapid prototyping and mask fabrication. Writing is possible on any type of substrate, including: photomasks, semiconductors, glass, polymers, crystals, flexible films. Lab-on-a-chip, Microfluidic chip fabrication, integration and interfacing

The Heidelberg MLA150 is an advanced maskless aligner designed for direct-write laser lithography. It is ideal for research and development, rapid prototyping, and small production volumes. The MLA150 eliminates the need for traditional photomasks by directly writing the design onto the photoresist-coated substrate using a laser. This approach significantly reduces cycle times and allows for quick design modifications by simply changing the CAD layout.

Minimum Structure Size [μm]: 1 μm; Maximum Write Area [mm²]: 150 x 150; Alignment Accuracy*[3σ, nm] for 100 x 100 mm²: <=500. Maskless Aligner

The Heidelberg MLA150 is an advanced maskless aligner designed for direct-write laser lithography. It is ideal for research and development, rapid prototyping, and small production volumes. The MLA150 eliminates the need for traditional photomasks by directly writing the design onto the photoresist-coated substrate using a laser. This approach significantly reduces cycle times and allows for quick design modifications by simply changing the CAD layout.

The MLA150 is equipped with both 405nm and 375nm solid state laser sources. It is equipped with write mode I and is capable of producing minimum structure size of 0.6um. The system comes equipped with an automated handling unit which can support batch direct-write lithography on standard size wafers such as 6in and 4in substrates as well as 5in mask plates.

The Heidelberg MLA150 is an advanced maskless aligner designed for direct-write laser lithography. It is ideal for research and development, rapid prototyping, and small production volumes. The MLA150 eliminates the need for traditional photomasks by directly writing the design onto the photoresist-coated substrate using a laser. This approach significantly reduces cycle times and allows for quick design modifications by simply changing the CAD layout.

Maskless lithography is an alternative to the traditional mask aligner that exposes the pattern directly onto the substrate surface with a spatial light modulator (SLM). The MLA 150 offers flexibility, throughput, and performance for fast prototyping on various substrates. The minimum feature size is 0.6 micron. Maskless direct write system

3D Printing with a minimum voxel size of 100 x 350 nm. The dual photon technology is used to construct high resolution and complex structures in polymers (such as AZ resist, SU8 and proprietary IP resists from Nanoscribe).

Uses a IR femto second laser to concentrate pulses to within a small polymerisation volume equivalent to UV light. Within this volume polymerisation occurs to create nanoscale 3D structures. Resists sensitive to UV light can be used. Substrates can be up to 5 inch square. 100-nanometre resolution 3D printer