Manual flip-chip bonder for small substrates below 5x5mm2

Max. die/package size: 16 mm (pick-n-place only). Min. die/package size: 5 mm × 5 mm. Substrate size: 20 mm × 20 mm (thermal compression). Bonding mechanism: thermo-compression (bonding force 0.1 ~ 200 N). Reflow (RT ~ 400 °C, heating rate: 20 °C/s) Flip chip bonder

Sub-micron die-bonder for precision die attach and advanced chip packaging.

Ultrasonic or thermosonic bonding, formic acid, adhesive dispense module. Sub-Micron Die Bonder

Used to align and place/bond chips on PCB or larger chips using metal bonding.

0.5 micron placement accuracy. Substrate temperature 400 degrees C. Thermocompression bonding. Flip chip bonder

The UniTemp RVS-210 is a compact reflow solder system designed for laboratory and cleanroom applications, specifically for reflowing indium bumps into balls for flip-chip bonding. It features a vacuum-sealed chamber with a viewing window, ensuring precise visual control of the soldering process.

Allows reflow of Indium bumps in forming gas atmosphere. Indium is widely used for electrical interconnections in various semiconductor devices due to its physicochemical properties. An indium bump array is most commonly fabricated using a lift-off process in conjunction with photolithography. After indium columns are fabricated, a reflow process is performed to form bumps which are of the same height thus ensuring contact is made uniformly during the bonding process. Reflow solder oven

Designed for bonding, embossing and nanoimprinting applications the system can thermally bond glass substrates and emboss channel geometries into substrates.

Capable of all wafer bonding processes such as thermo-compression, fusion or low temperature bonding. It is configured to allow hot embossing of polymers and even glass. Substrate bonder