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Wafer bonding
Wafer bonding
Bonding a wafer to another wafer is a step commonly used when packaging components in an micro or nanoelectrical device. It can help a form new functions in a device, or can ensure mechanical and hermetic encapsulation of devices and electronics. The result is typically irreversible. Common bonding methods include using heat or with an adhesive for thermally sensitive samples.
List of available equipment
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Finetech Fineplacer Lambda
Flip chip bonder
ACT Node
Australian National University (ANU)
Description
Used to align and place/bond chips on PCB or larger chips using metal bonding
Related Information
0.5 micron placement accuracy. Substrate temperature 400 degrees C. Thermocompression bonding.
Tool Contact
horst.punzmann@anu.edu.au
Finetech Fineplacer-96 flip-chip bonder
Flip chip bonder
University of Western Australia
WA Node
Description
Manual flip-chip bonder with high accuracy of 0.5 μm.
Related Information
Max. die/package size: 16 mm (pick-n-place only). Min. die/package size: 0.5 mm. Substrate size: 50 mm × 50 mm (thermal compression), 180 mm × 108 mm (pick-n-place only). Bonding mechanism: thermo-compression (bonding force 0.1 ~ 200 N). Reflow (RT ~ 400 °C, heating rate: 20 °C/s), thermo-sonic.
Tool Contact
anff-wa@uwa.edu.au
Flip chip bonding- Finetech FINEPLACER lambda
Sub-Micron Die Bonder
NSW Node
University of Sydney
Description
Sub-micron die-bonder for precision die attach and advanced chip packaging.
Related Information
Ultrasonic or thermosonic bonding, formic acid, adhesive dispense module.
Tool Contact
rpf.queries@sydney.edu.au
Substrate Bonder- EVG520
Substrate bonder
SA Node
University of South Australia
Description
Designed for bonding, embossing and nanoimprinting applications the system can thermally bond glass substrates and emboss channel geometries into substrates.
Related Information
Capable of all wafer bonding processes such as thermo-compression, fusion or low temperature bonding. It is configured to allow hot embossing of polymers and even glass.
Tool Contact
Simon.Doe@unisa.edu.au
UniTemp RVS-210 Indium reflow system
Reflow solder oven
University of Western Australia
WA Node
Description
Used to reflow Indium bumps into balls for flip-chip bonding
Related Information
Allows reflow of Indium bumps in forming gas atmosphere. Indium is widely used for electrical interconnections in various semiconductor devices due to its physicochemical properties. An indium bump array is most commonly fabricated using a lift-off process in conjunction with photolithography. After indium columns are fabricated, a reflow process is performed to form bumps which are of the same height thus ensuring contact is made uniformly during the bonding process.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Finetech Fineplacer Lambda
Flip chip bonder
University of Western Australia
WA Node
Description
Used to align and place/bond chips on PCB or larger chips using metal bonding
Related Information
0.5 micron placement accuracy. Substrate temperature 400 degrees C. Thermocompression bonding.
Tool Contact
horst.punzmann@anu.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Finetech Fineplacer-96 flip-chip bonder
Flip chip bonder
University of Western Australia
WA Node
Description
Manual flip-chip bonder with high accuracy of 0.5 μm.
Related Information
Max. die/package size: 16 mm (pick-n-place only). Min. die/package size: 0.5 mm. Substrate size: 50 mm × 50 mm (thermal compression), 180 mm × 108 mm (pick-n-place only). Bonding mechanism: thermo-compression (bonding force 0.1 ~ 200 N). Reflow (RT ~ 400 °C, heating rate: 20 °C/s), thermo-sonic.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Flip chip bonding- Finetech FINEPLACER lambda
Sub-Micron Die Bonder
University of Western Australia
WA Node
Description
Sub-micron die-bonder for precision die attach and advanced chip packaging.
Related Information
Ultrasonic or thermosonic bonding, formic acid, adhesive dispense module.
Tool Contact
rpf.queries@sydney.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Substrate Bonder- EVG520
Substrate bonder
University of Western Australia
WA Node
Description
Designed for bonding, embossing and nanoimprinting applications the system can thermally bond glass substrates and emboss channel geometries into substrates.
Related Information
Capable of all wafer bonding processes such as thermo-compression, fusion or low temperature bonding. It is configured to allow hot embossing of polymers and even glass.
Tool Contact
Simon.Doe@unisa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
UniTemp RVS-210 Indium reflow system
Reflow solder oven
University of Western Australia
WA Node
Description
Used to reflow Indium bumps into balls for flip-chip bonding
Related Information
Allows reflow of Indium bumps in forming gas atmosphere. Indium is widely used for electrical interconnections in various semiconductor devices due to its physicochemical properties. An indium bump array is most commonly fabricated using a lift-off process in conjunction with photolithography. After indium columns are fabricated, a reflow process is performed to form bumps which are of the same height thus ensuring contact is made uniformly during the bonding process.
Tool Contact
anff-wa@uwa.edu.au
