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Wafer bonding
Wafer bonding
Bonding a wafer to another wafer is a step commonly used when packaging components in an micro or nanoelectrical device. It can help a form new functions in a device, or can ensure mechanical and hermetic encapsulation of devices and electronics. The result is irreversible.Common bonding methods include using heat or with an adhesive for thermally sensitive samples.
List of available equipment
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
EVG 520
Hot embossing and wafer bonding
ACT Node
Australian National University (ANU)
Description
Hot Embossing, Nanoimpint lithography, and wafer bonding
Related Information
Process up to a 6 inch wafer, 500 degrees C max temperature.
Tool Contact
horst.punzmann@anu.edu.au
Finetech Fineplacer Lambda
Flip chip bonder
ACT Node
Australian National University (ANU)
Description
Used to align and place/bond chips on PCB or larger chips using metal bonding
Related Information
0.5 micron placement accuracy. Substrate temperature 400 degrees C. Thermocompression bonding.
Tool Contact
horst.punzmann@anu.edu.au
Finetech Fineplacer-96
Flip chip bonder
University of Western Australia
WA Node
Description
Manual flip chip bonder with high accuracy of 0.5 μm.
Related Information
Max. die/package size: 16 mm (pick-n-place only)Min. die/package size: 0.5 mmSubstrate size: 50 mm × 50 mm (thermal compression), 180 mm × 108 mm (pick-n-place only)Bonding mechanism: thermo-compression (bonding force 0.1 ~ 200 N). Reflow (RT ~ 400 °C, heating rate: 20 °C/s), thermo-sonic.
Tool Contact
anff-wa@uwa.edu.au
EVG 520…
Substrate bonder
SA Node
University of South Australia
Description
Designed for bonding, embossing and nanoimprinting applications the system can thermally bond glass substrates and emboss channel geometries into substrates.
Related Information
Capable of all wafer bonding processes such as thermo-compression, fusion or low temperature bonding. It is configured to allow hot embossing of polymers and even glass.
Tool Contact
Simon.Doe@unisa.edu.au
EVG 520
Hot embossing tool
Melbourne Centre for Nanofabrication
VIC Node
Description
Can emboss wafers and perform bonding such as anodic bonding, fusion bonding, eutectic bonding and epoxy bonding.
Related Information
Used for controlled embossing into polycarbonate and COC substrates of up to 6 inches in diameter.
Tool Contact
mcn-enquiries@nanomelbourne.com
EVG 520
Hot embossing tool for 6 inch wafers
QLD Node
University of Queensland
Description
Can emboss wafers of up to 6-inch diameter. Can also perform bonding such as anodic bonding, fusion bonding, eutectic bonding and epoxy bonding.
Related Information
Used for controlled embossing into substrates such as polycarbonate and COC. Can also perform wafer bonding. Temperature of 650°C and pressures of 60kN are possible. Power supply for anodic bonding: 0 – 2.000 V/50 mA
Tool Contact
anff@uq.edu.au
Finetech Fineplacer Lambda
Sub-Micron Die Bonder
NSW Node
University of Sydney
Description
Sub-micron die-bonder for precision die attach and advanced chip packaging.
Related Information
Ultrasonic or thermosonic bonding, formic acid, adhesive dispense module.
Tool Contact
rpf.queries@sydney.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
EVG 520
Hot embossing and wafer bonding
NSW Node
University of Sydney
Description
Hot Embossing, Nanoimpint lithography, and wafer bonding
Related Information
Process up to a 6 inch wafer, 500 degrees C max temperature.
Tool Contact
horst.punzmann@anu.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Finetech Fineplacer Lambda
Flip chip bonder
NSW Node
University of Sydney
Description
Used to align and place/bond chips on PCB or larger chips using metal bonding
Related Information
0.5 micron placement accuracy. Substrate temperature 400 degrees C. Thermocompression bonding.
Tool Contact
horst.punzmann@anu.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Finetech Fineplacer-96
Flip chip bonder
NSW Node
University of Sydney
Description
Manual flip chip bonder with high accuracy of 0.5 μm.
Related Information
Max. die/package size: 16 mm (pick-n-place only)Min. die/package size: 0.5 mmSubstrate size: 50 mm × 50 mm (thermal compression), 180 mm × 108 mm (pick-n-place only)Bonding mechanism: thermo-compression (bonding force 0.1 ~ 200 N). Reflow (RT ~ 400 °C, heating rate: 20 °C/s), thermo-sonic.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
EVG 520…
Substrate bonder
NSW Node
University of Sydney
Description
Designed for bonding, embossing and nanoimprinting applications the system can thermally bond glass substrates and emboss channel geometries into substrates.
Related Information
Capable of all wafer bonding processes such as thermo-compression, fusion or low temperature bonding. It is configured to allow hot embossing of polymers and even glass.
Tool Contact
Simon.Doe@unisa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
EVG 520
Hot embossing tool
NSW Node
University of Sydney
Description
Can emboss wafers and perform bonding such as anodic bonding, fusion bonding, eutectic bonding and epoxy bonding.
Related Information
Used for controlled embossing into polycarbonate and COC substrates of up to 6 inches in diameter.
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
EVG 520
Hot embossing tool for 6 inch wafers
NSW Node
University of Sydney
Description
Can emboss wafers of up to 6-inch diameter. Can also perform bonding such as anodic bonding, fusion bonding, eutectic bonding and epoxy bonding.
Related Information
Used for controlled embossing into substrates such as polycarbonate and COC. Can also perform wafer bonding. Temperature of 650°C and pressures of 60kN are possible. Power supply for anodic bonding: 0 – 2.000 V/50 mA
Tool Contact
anff@uq.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Finetech Fineplacer Lambda
Sub-Micron Die Bonder
NSW Node
University of Sydney
Description
Sub-micron die-bonder for precision die attach and advanced chip packaging.
Related Information
Ultrasonic or thermosonic bonding, formic acid, adhesive dispense module.
Tool Contact
rpf.queries@sydney.edu.au