Wafer dicing
Wafer dicing
Nanofabricated devices are generally made in batches on wafers and need to be separated or packaged before use. This separation can be achieved through wet or dry dicing. In a wet dicing operation, a precision, high-speed, diamond impregnated blade is used to mill narrow grooves between the devices either partially or completely through the wafer. During this process, water is circulated over the cutting surface to cool the blade and prevent the liberation of dangerous particulates into the air. Materials which would be damaged by water are diced using a dry process known as scribing. Scribing utilises a diamond tipped stylus which is drawn across the wafer surface creating lines of high-stress which are later broken over precision fulcrum.
List of available equipment
TOOL MAKE AND MODEL
LOCATION
2 Photon 3D Printer, UpNano NanoOne 1000
ANFF SA
3 axis CNC Mill, Fanuc Robodrill
ANFF SA
3 axis CNC Mill, King Rich Turrett
ANFF SA
3 axis CNC Mill, Kira SuperMill 2M
ANFF SA
3 axis CNC Mill, Roland MDX-50 CNC
ANFF SA
3C Silicon Carbide Epitaxial Furnace, SPT Micro EpiFlx
ANFF QLD Griffith
3D Bioprinter, Advanced Solutions BioAssemblyBot 400
ANFF MATERIALS Wollongong
3D Bio Printing System, GeSim BioScaffolder 3.2
ANFF MATERIALS Wollongong
3D Digital Optical Profiler, Leica DCM8
ANFF NSW USYD
3D Measuring Laser Microscope, Olympus OLS5100
ANFF MATERIALS Wollongong
3D Microprinting, Nanoscribe PPGT2
ANFF NSW USYD
3D Optical Microscope, Bruker ContourGT-K
ANFF OPTOFAB Adelaide
3D Optical Profilometer, Bruker Contour GTI
ANFF VIC MCN
3D Printer, Apium M220
ANFF MATERIALS Wollongong
3D Printer, Bambu Lab X1-Carbon
ANFF SA
3D Printer, CadWorks Profluidics 285D
ANFF SA
3D Printer, Desktop Metal Studio System
ANFF SA
3D printer, Figure 4
ANFF QLD UQ - AIBN
3D Printer, Form 3+
ANFF SA
3D Printer, FormLabs Form2
ANFF MATERIALS Wollongong
3D Printer, GE ConceptLaser Mlab 200R
ANFF MATERIALS Wollongong
3D Printer, Lithoz Ceramics
ANFF MATERIALS Wollongong
3D Printer, Lulzbot TAZ 5
ANFF SA
3D Printer, Makerbot Method X
ANFF SA
3D Printer, Markforged Mark Two
ANFF SA
3D Printer, Markforged Mk.2
ANFF MATERIALS Wollongong
3D Printer, Markforged X7
ANFF MATERIALS Wollongong
3D Printer Multimaterial, Stratasys J826
ANFF VIC MCN
3D printer, Objet Connex 350
ANFF MATERIALS Wollongong
3D Printer, Projet MJP 2500Plus
ANFF QLD UQ - AIBN
3D Printer, Stratasys F370
ANFF MATERIALS Wollongong
3D Printer, Stratasys Fortus 450mc
ANFF SA
3D Printer, Stratasys J735
ANFF SA
3D Printer, Stratasys J826
ANFF MATERIALS Wollongong
3D Printer, Trumpf TruPrint 1000
ANFF MATERIALS Wollongong
3D Printer, Ultimaker 2 Extended +
ANFF QLD UQ - AIBN
3D Printing, NanoScribe
ANFF VIC MCN
3D Scanner, Artec Leo
ANFF MATERIALS Wollongong
3D scanning, Artec Spyder
ANFF MATERIALS Wollongong
3D scanning, Artec Spyder
ANFF VIC MCN
4m Drawing Tower, Heathway/Controls Interface
ANFF OPTOFAB Adelaide
5 axis CNC Mill, HAAS Compact
ANFF SA Flinders
5 axis CNC Mill, Willemin Macodel 408S
ANFF SA
6m Drawing Tower, Heathway/Controls Interface
ANFF OPTOFAB Adelaide
Aerosol spray coater, Sono-Tek
ANFF VIC CSIRO
Amotic Layer Deposition (ALD) system
ANFF SA Flinders
Amotic Layer Deposition (ALD) system, Cambridge NanoTech Fiji 200
ANFF VIC MCN
Amotic Layer Deposition (ALD) system, Cambridge NanoTech Savannah S100
ANFF VIC MCN
Amotic Layer Deposition (ALD) system, Cambridge NanoTech Savannah S200
ANFF NSW UNSW
Amotic Layer Deposition (ALD) system, PicoSun R-200
ANFF NSW UNSW
TOOL MAKE AND MODEL
LOCATION
Dicing Saw, Accretech SS20
Description
The Accretech SS20 is a semi-automatic dicing saw designed for precision wafer cutting in semiconductor manufacturing and electronic component processing. It supports 200mm wafers and square substrates up to 250mm, ensuring high rigidity and stability for accurate dicing.
Related Information
Tool Contact
anff@uq.edu.au
TOOL MAKE AND MODEL
LOCATION
Dicing saw, Accretech SS20
Wafer dicer
Description
The Accretech SS20 is a semi-automatic dicing saw designed for precision wafer cutting in semiconductor manufacturing and electronic component processing. It supports 200mm wafers and square substrates up to 250mm, ensuring high rigidity and stability for accurate dicing.
Related Information
The Accretech SS20 dicing saw uses a rotating ultra-thin diamond impregnated blade, in a wet environment, to cut materials such as silicon wafers, III-V semiconductors, glass sheets, ceramic, etc. into almost any shapes with straight edges. Cutting process is controlled automatically through software recipe programming. The machine is also capable of accurate, multi-directional on-screen semiautomatic alignment. Wafer dicer
Tool Contact
ANFF-SA@unisa.edu.au
TOOL MAKE AND MODEL
LOCATION
Dicing Saw, ADT Provectus 7100
Wafer dicer
Description
Fully programmable dicing saw capable of dicing up to 8 inch wafers.
Related Information
Provides high precision dicing, best performing matrix for hard, brittle and composite materials. Can dice hard and thick materials. Saw blade minimal width of 20 µm. Axis resolution in Y of 200 nm and Z of 200nm. Speed up to 350 mm/s. Wafer dicer
Tool Contact
anff@uq.edu.au
TOOL MAKE AND MODEL
LOCATION
Dicing saw, Disco DAD 3240
Description
The Disco DAD 3240 is a compact automatic dicing saw designed for precision cutting of semiconductor wafers, glass, quartz, sapphire, and other hard materials. It features a high-output 1.8 kW spindle, enabling efficient processing of silicon and difficult-to-cut materials like ceramics.
Related Information
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
LOCATION
Automatic Dicing Saw, Disco DAD 3240
Automatic dicing saw
Description
The Disco DAD 3240 is a compact automatic dicing saw designed for precision cutting of semiconductor wafers, glass, quartz, sapphire, and other hard materials. It features a high-output 1.8 kW spindle, enabling efficient processing of silicon and difficult-to-cut materials like ceramics.
Related Information
Adoption of a 1.8 kW high-output spindle enables the processing of a wide range of materials from silicon to difficult-to-process materials like ceramics. Automatic dicing saw
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
LOCATION
Dicing saw, Disco DAD 3350
Description
The DAD3350 is capable of handling a maximum size of 8in diameter substrate and a maximum thickness of 5mm. The dicing saw is also capable of performing circle cut, trimming down circular shape samples and chopper cut. During this process, water is circulated over the cutting surface to cool the blade and prevent the liberation of dangerous particulates into the air.
Related Information
A precision, high-speed, diamond impregnated blade is used to mill narrow grooves between the devices either partially or completely through the wafer.
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
LOCATION
Femtosecond Laser System, microPRO XS
Description
The microPRO XS is a high-speed femtosecond laser system with 40W power and three wavelengths (343nm, 515nm, and 1030nm), designed for precision micromachining in semiconductor manufacturing and advanced packaging. Its ultra-short pulse durations enable minimal thermal impact and high-resolution processing for silicon carbide (SiC) power devices.
Related Information
These systems generate laser pulses with durations on the order of femtoseconds (10^-15 seconds), enabling precise control over laser interactions with matter at extremely short timescales. Femtosecond lasers are utilized for a wide range of applications including micromachining, spectroscopy, nonlinear optics, and ultrafast imaging, among others.
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
LOCATION
Wafer scriber, OEG MR200
Diamond scriber manual dicing tool
Description
The OEG MR200 is a precision micro diamond wafer scriber designed for manual scribing and defined cutting of structured silicon wafers. It enables high-accuracy scribing for REM preparations, chip singulation, and laboratory applications.
Related Information
Scriber for precision cuts of samples in diverse materials, such as Si, SiC, sapphire, III-V compounds and glass with a sample sizes ranging from 10x10 mm² to 200x200 mm² and less than 1mm in thickness. Diamond scriber manual dicing tool
Tool Contact
horst.punzmann@anu.edu.au
TOOL MAKE AND MODEL
LOCATION
Wafer scriber, OEG MR200
Description
The OEG MR200 is a precision micro diamond wafer scriber designed for manual scribing and defined cutting of structured silicon wafers. It enables high-accuracy scribing for REM preparations, chip singulation, and laboratory applications.
Related Information
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
LOCATION
Wafer scriber, Suss scriber
Wafer scriber
Description
The SUSS RA120M Automatic Scriber is a high-precision wafer scribing system designed for GaAs and other sensitive materials. It enables precise scribing with programmable depth, speed, and pressure, ensuring clean and controlled separation of substrates.
Related Information
More information to come. Wafer scriber
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
LOCATION
Wire saw, MTI Saw
Diamond wire saw and Wafer Saw
Description
The MTI Diamond Wire Saw is a precision wafer saw designed for low-stress slicing of fragile materials, including glass ingots and wafers. Utilising a continuous diamond-coated wire, it enables smooth and accurate cuts with minimal material loss, making it ideal for small sample preparation in materials research and semiconductor fabrication.
Related Information
Typical prepares 10-40mm areas samples of glass for photonic inscription Diamond wire saw and Wafer Saw
Tool Contact
benjamin.johnston@mq.edu.au