ANFF Experts
Mr Derui Yin
Senior Packaging Engineer
Derui Yin is a Senior Process Engineer specialising in packaging. With extensive experience in the semiconductor industry and a master's degree in Electrical & Electronics Engineering, he brings advanced knowledge in 2.5D, 3D-IC, and wafer-level packaging. His expertise includes managing packaging capabilities, providing technical support to researchers, and ensuring proper facility maintenance.
University of Sydney
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