Annealing
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Annealing

Annealing is a process that can reduce residual stress in a substrate that has accumulated during prior processes such as deposition. The material is heated to high temperatures and allowed to cool at a controlled rate. This allows the material’s crystal structure to relax into a less intrinsically stressed state, and to settle into a more desirable microstructure as it cools.

List of available equipment
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Anealsys AS-One 150 RTA
Rapid thermal annealer
University of Western Australia WA Node
Description
A cold wall bench top rapid thermal processor, to provide high cooling rates and low memory effect of the process chamber.
Related Information
Process gases: nitrogen, oxygen, forming gas. Max heating rate of 50°C/s.
Tool Contact
anff-wa@uwa.edu.au
Cascade Tek vacuum oven(300C)
Vacuum Oven@300C and below
Australian National University (ANU) Optofab Node
Description
Vacuum Oven for annealing at 300C and below
Related Information
This oven is designed for baking and annealing processes at temperatures up to 300C and vacuum levels down to 20mTorr. It is suitable for samples that require high-temperature and low-pressure conditions.
Tool Contact
stephen.madden@anu.edu.au
Four Tube Furnace (Doping/Oxidation/Nitride)
Furnace for atmospheric pressure diffusion, annealing, and LPCVD
Melbourne Centre for Nanofabrication VIC Node
Description
The SVCS four-tube horizontal furnace system with a HEPA controlled loading station with small batch processing options. The four processing tubes cater for atmospheric pressure diffusion, atmospheric pressure annealing and the low-pressure chemical vapour deposition of low strain and stoichiometric silicon nitride.
Related Information
Atmospheric pressure diffusion furnaces - phosphorous and boron doping. Atmospheric pressure annealing/oxidizing (dry) furnace for Si/SiO2 only. LPCVD furnace for silicon nitride with controlled film stress. Batch process - up to 50 wafers. Substrate size - up to 6" wafers
Tool Contact
mcn-enquiries@nanomelbourne.com
General Purpose Furnace
More information to come.
Melbourne Centre for Nanofabrication VIC Node
Description
General-purpose furnace is used for calcining, annealing samples (up to 6” diameter wafer) under vacuum, or various other gas atmospheres (Ar, N2, O2 or forming gas) with a temperature up to 1100°C.
Related Information
General-purpose furnace has a 7.5" ID x 13.4"L quartz tube chamber placed horizontally. Water-cooled stainless steel vacuum flanges with valves are installed to achieve a vacuum of few millitorr using a 2-stage rotary vane pump. It is integrated with a 4-channer gas mixing station, which pre-mix the inlet gases before supplying to the furnace.
Tool Contact
mcn-enquiries@nanomelbourne.com
Heraeus T6060
Vacuum annealing
Australian National University (ANU) Optofab Node
Description
More information to come.
Related Information
More information to come.
Tool Contact
stephen.madden@anu.edu.au
High vacuum ovens (600C at 10-6 Torr)
High Vacuum oven @600C
Australian National University (ANU) Optofab Node
Description
More information to come.
Related Information
More information to come.
Tool Contact
stephen.madden@anu.edu.au
Jipelec JetFirst
Rapid thermal annealer
ACT Node Australian National University (ANU)
Description
To anneal and bake semiconductors or polymer samples.Maximum temperature: 1,400 degrees C (5 minutes max, lower temperatures up to 15 minutes max).
Related Information
Available gases include O2 and CF4. The system is suitable to remove organic/polymers but also dielectics including SiOx
Tool Contact
horst.punzmann@anu.edu.au
Labec HTF 60 annealing furnace
Horizontal tube furnace
University of Western Australia WA Node
Description
Anneals semiconductor samples at high temperatures
Related Information
Maximum temperature up to 1200 degree celcius with an accuracy of 1 degree celcius. 10 heating zones. Horizontal tube furnace with 10 heating zones and independent temperature control on each zone. Internal annealing tube diameter of 60mm.
Tool Contact
anff-wa@uwa.edu.au
Nabertherm 600C Oven
Annealing Oven
Australian National University (ANU) Optofab Node
Description
Oven for annealing at 600C and below
Related Information
This electrically heated air circulation furnace that can anneal thin films up to 600°C in various atmospheres. The furnace has a large chamber with very uniform temperature distribution and can use air, humid air or nitrogen as the annealing gas.
Tool Contact
stephen.madden@anu.edu.au
Powatec U-200 UV curing system
UV-LED curing station
University of Western Australia WA Node
Description
Performs UV curing of samples
Related Information
Generates a wavelength of 365 mm with an optical power output maximum of 750 mW. The POWATEC Curing systems are built to cure wafers and frames up to 8". The LED generates a wavelength of 365 nm with an optical power output of maximum 750 mW.
Tool Contact
anff-wa@uwa.edu.au
Thermal Annealer- Jipelec Jetfirst
Rapid thermal annealer
NSW Node University of New South Wales
Description
Rapid thermal annealer
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
Thermco clean silicon annealing
Furnace
NSW Node University of New South Wales
Description
clean anneal furnace (MOS)
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
Thermco GP annealing
General purpose furnace
NSW Node University of New South Wales
Description
general purpose anneal furnace
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
Thermoline Vacuum Oven(200C)
Vacuum Oven @200C
Australian National University (ANU) Optofab Node
Description
Vacuum Oven for annealing at 200C and below
Related Information
This oven is designed for baking and annealing samples at temperatures up to 200C and vacuum levels down to 20mTorr. It is a high-temperature, low-pressure oven suitable for various applications.
Tool Contact
stephen.madden@anu.edu.au
Vacuum Furnace- R.D. Webb Red Devil
Vacuum Furnace
SA Node University of South Australia
Description
High temperature (1,200°C) vacuum or inert gas furnace for bonding and heat treatments or could also be used for annealing.
Related Information
Commonly used for microfluidic devices, or during production of small high-value components.
Tool Contact
Simon.Doe@unisa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Anealsys AS-One 150 RTA
Rapid thermal annealer
SA Node University of South Australia
Description
A cold wall bench top rapid thermal processor, to provide high cooling rates and low memory effect of the process chamber.
Related Information
Process gases: nitrogen, oxygen, forming gas. Max heating rate of 50°C/s.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Cascade Tek vacuum oven(300C)
Vacuum Oven@300C and below
SA Node University of South Australia
Description
Vacuum Oven for annealing at 300C and below
Related Information
This oven is designed for baking and annealing processes at temperatures up to 300C and vacuum levels down to 20mTorr. It is suitable for samples that require high-temperature and low-pressure conditions.
Tool Contact
stephen.madden@anu.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Four Tube Furnace (Doping/Oxidation/Nitride)
Furnace for atmospheric pressure diffusion, annealing, and LPCVD
SA Node University of South Australia
Description
The SVCS four-tube horizontal furnace system with a HEPA controlled loading station with small batch processing options. The four processing tubes cater for atmospheric pressure diffusion, atmospheric pressure annealing and the low-pressure chemical vapour deposition of low strain and stoichiometric silicon nitride.
Related Information
Atmospheric pressure diffusion furnaces - phosphorous and boron doping. Atmospheric pressure annealing/oxidizing (dry) furnace for Si/SiO2 only. LPCVD furnace for silicon nitride with controlled film stress. Batch process - up to 50 wafers. Substrate size - up to 6" wafers
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
General Purpose Furnace
More information to come.
SA Node University of South Australia
Description
General-purpose furnace is used for calcining, annealing samples (up to 6” diameter wafer) under vacuum, or various other gas atmospheres (Ar, N2, O2 or forming gas) with a temperature up to 1100°C.
Related Information
General-purpose furnace has a 7.5" ID x 13.4"L quartz tube chamber placed horizontally. Water-cooled stainless steel vacuum flanges with valves are installed to achieve a vacuum of few millitorr using a 2-stage rotary vane pump. It is integrated with a 4-channer gas mixing station, which pre-mix the inlet gases before supplying to the furnace.
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Heraeus T6060
Vacuum annealing
SA Node University of South Australia
Description
More information to come.
Related Information
More information to come.
Tool Contact
stephen.madden@anu.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
High vacuum ovens (600C at 10-6 Torr)
High Vacuum oven @600C
SA Node University of South Australia
Description
More information to come.
Related Information
More information to come.
Tool Contact
stephen.madden@anu.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Jipelec JetFirst
Rapid thermal annealer
SA Node University of South Australia
Description
To anneal and bake semiconductors or polymer samples.Maximum temperature: 1,400 degrees C (5 minutes max, lower temperatures up to 15 minutes max).
Related Information
Available gases include O2 and CF4. The system is suitable to remove organic/polymers but also dielectics including SiOx
Tool Contact
horst.punzmann@anu.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Labec HTF 60 annealing furnace
Horizontal tube furnace
SA Node University of South Australia
Description
Anneals semiconductor samples at high temperatures
Related Information
Maximum temperature up to 1200 degree celcius with an accuracy of 1 degree celcius. 10 heating zones. Horizontal tube furnace with 10 heating zones and independent temperature control on each zone. Internal annealing tube diameter of 60mm.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Nabertherm 600C Oven
Annealing Oven
SA Node University of South Australia
Description
Oven for annealing at 600C and below
Related Information
This electrically heated air circulation furnace that can anneal thin films up to 600°C in various atmospheres. The furnace has a large chamber with very uniform temperature distribution and can use air, humid air or nitrogen as the annealing gas.
Tool Contact
stephen.madden@anu.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Powatec U-200 UV curing system
UV-LED curing station
SA Node University of South Australia
Description
Performs UV curing of samples
Related Information
Generates a wavelength of 365 mm with an optical power output maximum of 750 mW. The POWATEC Curing systems are built to cure wafers and frames up to 8". The LED generates a wavelength of 365 nm with an optical power output of maximum 750 mW.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Thermal Annealer- Jipelec Jetfirst
Rapid thermal annealer
SA Node University of South Australia
Description
Rapid thermal annealer
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Thermco clean silicon annealing
Furnace
SA Node University of South Australia
Description
clean anneal furnace (MOS)
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Thermco GP annealing
General purpose furnace
SA Node University of South Australia
Description
general purpose anneal furnace
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Thermoline Vacuum Oven(200C)
Vacuum Oven @200C
SA Node University of South Australia
Description
Vacuum Oven for annealing at 200C and below
Related Information
This oven is designed for baking and annealing samples at temperatures up to 200C and vacuum levels down to 20mTorr. It is a high-temperature, low-pressure oven suitable for various applications.
Tool Contact
stephen.madden@anu.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Vacuum Furnace- R.D. Webb Red Devil
Vacuum Furnace
SA Node University of South Australia
Description
High temperature (1,200°C) vacuum or inert gas furnace for bonding and heat treatments or could also be used for annealing.
Related Information
Commonly used for microfluidic devices, or during production of small high-value components.
Tool Contact
Simon.Doe@unisa.edu.au

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