Direct laser lithography
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Direct laser lithography

Laser processing uses a highly controlled and focused beam of high-energy photons of the same wavelength to burn away material. These processes are repeatable, scalable and cheap, but can induce thermal stresses on the substrate, and resolutions tend to be in the micrometre regime. Laser processing is often used within ANFF to create masks for later lithography steps, but it can also be used to create patterns directly into the substrate itself, skipping several ordinary fabrication steps.

List of available equipment
TOOL MAKE AND MODEL
LOCATION
3D Microprinting, Nanoscribe PPGT2
ANFF NSW USYD
3D Printing, NanoScribe
ANFF VIC MCN
Direct Write Laser, Dilase 650
ANFF SA
Direct Write Laser, Heidelberg 66+
ANFF NSW USYD
Direct write laser, Heidelberg MLA150
ANFF ACT
Direct write laser, Heidelberg MLA150
ANFF QLD UQ - AIBN
Direct write laser, Heidelberg MLA150
ANFF QLD Griffith
Direct write laser, Heidelberg MLA150
ANFF SA
Direct write laser, Heidelberg MLA150
ANFF VIC RMIT
Direct write laser, Heidelberg MLA150
ANFF VIC MCN
Maskless Direct Write System, Heidelberg MLA150
ANFF WA
Nanno 3D printer, Nanoscribe Photonic Professional GT
ANFF QLD UQ - AIBN