Electron Beam Evaporation (E-Beam Evaporation)
Electron Beam Evaporation (E-Beam Evaporation)
Electron-beam evaporation is a physical vapour deposition method for depositing thin films of metals, oxides and semiconductors in a high vacuum environment. Ultra high purity coating material is placed inside a vacuum chamber, typically as pellets in a crucible. Electron energy is used to heat these pellets, causing the coating material to enter the gas phase. Due to the vacuum environment, the evaporated particles can travel to the substrate without colliding with foreign particles, where they then condense on the substrate surface in a thin film. Electron beam evaporation is used to deposit electronic and optical films for the semiconductor industry and has applications in displays and photovoltaics. High melting point materials can be deposited at high deposition rates, making this a preferred process for refractory metal and ceramic films.
List of available equipment
TOOL MAKE AND MODEL
LOCATION
e-Beam evaporator HHV ATS500
ANFF QLD Griffith
E-Beam / thermal evaporator, AJA ATC-1800-E
ANFF NSW USYD
Electron Beam Evaporator, Angstrom engineering Nexdep Amod
ANFF VIC MCN
Electron Beam Evaporator, Edwards Auto 500
ANFF WA
Electron Beam Evaporator, Intlvac Nanochrome II
ANFF VIC MCN
Electron Beam Evaporator, Kurt J. Lesker PVD75
ANFF VIC RMIT
Electron Beam Evaporator, Scientific Vacuum Systems V6000
ANFF WA
Electron Beam Evaporator, Temescal BJD2000
ANFF ACT
Electron Beam Evaporator, ULVAC ei-5
ANFF VIC MCN
Intellivation Metallisation System
ANFF MATERIALS Newcastle
Ion Assisted E-Beam Evaporator, CSIRO DB600
ANFF OPTOFAB ANU
PVD, Kurt J Lesker 75 (Si)
ANFF NSW UNSW
PVD, Kurt J Lesker PVD75 (GP)
ANFF NSW UNSW
Thermal and e-beam evaporator, Temescal Systems FC-2000
ANFF QLD UQ - AIBN
TOOL MAKE AND MODEL
LOCATION
Ion Assisted E-Beam Evaporator, CSIRO DB600
Description
Ion Assisted E-Beam Evaporator – CSIRO DB600 High-capacity deposition tool with ion beam assisted electron-beam evaporation, supporting substrates up to 600 mm. Features include a 3-pocket e-beam source, End-Hall ion source, and in-situ optical monitoring for precise thin-film coatings of semiconductor, dielectric, and photonic materials.
Related Information
Ion beam assisted deposition of various semiconductor, dielectric and photonics materials. The DB 600 was a tool built by CSIRO to coat substrates up to 600mm diameter in a stationary substrate mode using a rotating uniformity “blade” to attain thickness uniformity to ~2%. It uses a 3 pocket electron beam source and also has a resistively heated baffled boat. It has an End-Hall ion source to provide Ion Beam Deposition mode. Has multiwavelength Ellipsometric and white light transmission optical monitorong systems.
Tool Contact
stephen.madden@anu.edu.au
TOOL MAKE AND MODEL
LOCATION
Electron Beam Evaporator, Angstrom engineering Nexdep Amod
Description
Able to deposit single or multi-stack film. Features ion-beam pre-cleaning and sample stage cooling capabilities. This system is reserved for precious metals and adhesion metals deposition only. The following materials are allowed in the chamber. (Au, Ag, Pt, Pd, Ti, Cr)
Related Information
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
LOCATION
Electron Beam Evaporator, Edwards Auto 500
Electron beam evaporator
Description
Ability to deposit ultra pure films of materials with high melting points and other materials that are difficult to deposit by resistance thermal evaporation. The tool allows thick film deposition and also multiple coatings.
Related Information
Materials: Au, Ti, Ge, Pt, Ni, Al, and certain other materials upon request. Electron beam evaporator
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
LOCATION
Electron Beam Evaporator, Intlvac Nanochrome II
Electron beam evaporator
Description
Single films or multi-material stacks are easily created using simple layer definitions. Features ion-beam pre-cleaning and sample heating capabilities.
Related Information
Features a 10kV power supply and supports up to sixteen 4 inch wafers or fifteen 6 inch wafers or wafer mounted samples.Coating thickness are from 2nm up to 200nm (thickness >200nm by approval). Currently available in the materials library are metals (Al, Cr, Ti, Au, Ag), oxides (SiO2, TiO2, Al2O3, ITO), fluorides (MgF2) and semiconductors (Si, Ge). Electron beam evaporator
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
LOCATION
Electron Beam Evaporator, Kurt J. Lesker PVD75
E-Beam evaporator
Description
KJLC PVD 75 Thin Film Deposition Systems
Related Information
Materials: Au, Ti, Ni, Pt, Al, and certain other materials upon request. E-Beam evaporator
Tool Contact
mnrf@rmit.edu.au
TOOL MAKE AND MODEL
LOCATION
Electron Beam Evaporator, Scientific Vacuum Systems V6000
Electron beam evaporator
Description
Ability to deposit ultra pure films of materials with high melting points and other materials that are difficult to deposit by resistance thermal evaporation. The tool allows thick film deposition and also multiple coatings.
Related Information
Up to 6-inch diameter confocal sputter magnetron target options. Materials: Ti, Au, and certain other materials upon request. Electron beam evaporator
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
LOCATION
Electron Beam Evaporator, Temescal BJD2000
Electron beam evaporator for depositing metals including Au, Pt, Ti, Al, Cr, Ge, Ni, Mo, Nb
Description
Equipment provides E-beam evaporation of metals and also features a thermal evaporation source for gold.
Related Information
Features an electron gun and up to six crucibles. Materials: Au, Pt, Ag, Ti, Cr, Al, Ge, Ni, Mo Electron beam evaporator for depositing metals including Au, Pt, Ti, Al, Cr, Ge, Ni, Mo, Nb
Tool Contact
horst.punzmann@anu.edu.au
TOOL MAKE AND MODEL
LOCATION
Electron Beam Evaporator, ULVAC ei-5
Description
Single films or multi-material stacks are easily created using simple layer definitions. Features ion-beam pre-cleaning and sample heating capabilities.
Related Information
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
LOCATION
PVD, Kurt J Lesker 75 (Si)
Description
The Kurt J. Lesker PVD 75 (Si) is a thin film deposition system designed for high-precision physical vapor deposition (PVD). It supports sputtering, electron beam evaporation, and thermal evaporation, making it ideal for semiconductor research, optics, and advanced materials fabrication.
Related Information
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
LOCATION
PVD, Kurt J Lesker PVD75 (GP)
Description
The Kurt J. Lesker PVD75 (GP) is a versatile thin film deposition system designed for high-precision physical vapor deposition (PVD). It supports sputtering, electron beam evaporation, and thermal evaporation, making it ideal for semiconductor research, optics, and advanced materials fabrication.
Related Information
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
LOCATION
Thermal and e-beam evaporator, Temescal Systems FC-2000
Electron beam evaporator
Description
Can perform thermal and e-beam evaporation on multiple wafers at the same time. Features six source pockets for multiple layer coatings.
Related Information
Available evaporation materials are: Al, Ni, Cr, Ag, Au, Ti, Cu, NiO, TiO2, MoO3, Al2O3 and ITO alongside 2 reactive gases. Features a Load Lock. Can hold up to 13 x 4 inch wafers. Substrate heater up to 300°C. E-gun power is 10kV Electron beam evaporator
Tool Contact
anff@uq.edu.au