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Plasma etching
Plasma etching
Plasma etching uses a finely controlled plasma to selectively remove material from a substrate.
List of available equipment
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
LAM Autoetch 480
Plasma Asher
Griffith University
QLD Node
Description
Plasma etching of 6 inch wafers using a semi-isotropic dry etch process. Can produce features of 3µm.
Related Information
Utilises SF6 and O. Used to etch SiC, SiN and SiO2 and polymer resists.
Tool Contact
South Bay RIE3000
O2 Plasma Asher/RIE
NSW Node
University of Sydney
Description
Reactive ion etch system dedicated to O2 and Ar plasma processes
Related Information
Used primarily for resist and sample cleaning.
Tool Contact
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
LAM Autoetch 480
Plasma Asher
NSW Node
University of Sydney
Description
Plasma etching of 6 inch wafers using a semi-isotropic dry etch process. Can produce features of 3µm.
Related Information
Utilises SF6 and O. Used to etch SiC, SiN and SiO2 and polymer resists.
Tool Contact
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
South Bay RIE3000
O2 Plasma Asher/RIE
NSW Node
University of Sydney
Description
Reactive ion etch system dedicated to O2 and Ar plasma processes
Related Information
Used primarily for resist and sample cleaning.
Tool Contact