Plasma etching
Plasma etching
Plasma etching uses a finely controlled plasma to selectively remove material from a substrate.
List of available equipment
TOOL MAKE AND MODEL
LOCATION
Atmospheric Plasma, Diener PlasmaBeam
ANFF VIC Swinburne
Barrel etcher, PVA Tepla 400
ANFF OPTOFAB ANU
Barrel Etcher, PVA Tepla Gigabatch 300
ANFF ACT
Barrel Plasma Asher, March Instruments PM-600
ANFF WA
Benchtop Plasma Asher, Harrick
ANFF VIC MCN
CI Etcher, Trion Minilock Phantom
ANFF NSW UTS
Etcher, XeF2
ANFF QLD UQ - AIBN
ICP Etcher, Oxford Instruments ICP-100
ANFF OPTOFAB ANU
ICP Plasma Etcher, STS Multiplex
ANFF QLD Griffith
Ion Beam Etcher, IntlVac Nanoquest I
ANFF NSW UTS
Large Plasma Asher, Alpha Plasma Q235
ANFF VIC MCN
Microwave Ashing system, PVA Tepla
ANFF QLD UQ - AIBN
O2 Plasma asher, Glow
ANFF NSW USYD
O2 plasma cleaner, Tergeo Benchtop
ANFF QLD UQ - AIBN
Plasma Cleaner, Tergeo Tabletop
ANFF QLD UQ - AIBN
Plasma Etching, LAM Autoetch 480
ANFF QLD Griffith
RIE Etching, South Bay RIE3000
ANFF NSW USYD
TOOL MAKE AND MODEL
LOCATION
Atmospheric Plasma, Diener PlasmaBeam
Description
Atmospheric plasma system with X/Y control to air plasma treat surfaces for cleaning and improved hydrophilicity
Related Information
Tool Contact
kljarvis@swin.edu.au
TOOL MAKE AND MODEL
LOCATION
Barrel etcher, PVA Tepla 400
Description
The Tepla Barrel Etcher is a versatile high-pressure plasma system designed for efficient cleaning and resist stripping. It excels in removing organic materials and resists with O2-plasma, ensuring clean pattern development with its low power setting. Additionally, it can strip resists and etch SiNx/SiOx layers by incorporating CF4. This robust machine can process either two 4-inch wafers or a single 6-inch wafer simultaneously.
Related Information
Photoresist stripping using O2 and Argon Stripping tool
Tool Contact
stephen.madden@anu.edu.au
TOOL MAKE AND MODEL
LOCATION
Barrel Etcher, PVA Tepla Gigabatch 300
Plasma asher
Description
Barrel Etcher to strip resist and clean samples. Useful during the fabrication of photovoltaic, optoelectronic or nano-photonic technologies as a vital part of the complete lithography process.
Related Information
Available gases include O2 and CF4. The system is suitable to remove organic/polymers but also dielectrics including SiOx Plasma asher
Tool Contact
horst.punzmann@anu.edu.au
TOOL MAKE AND MODEL
LOCATION
Barrel Plasma Asher, March Instruments PM-600
Barrel benchtop oxygen plasma etcher/asher.
Description
The March Instruments PM-600 Barrel Plasma Asher is a high-performance plasma etching system designed for surface cleaning, resist removal, and material processing in semiconductor fabrication and research applications.
Related Information
Oxygen plasma etch tool and/or plasma exposure in a barrel electrode configuration. Barrel benchtop oxygen plasma etcher/asher.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
LOCATION
Benchtop Plasma Asher, Harrick
Description
Harrick plasma etcher / asher
Related Information
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
LOCATION
CI Etcher, Trion Minilock Phantom
Cl etcher
Description
The high-powered Cl Etcher tool is ideal for precise material removal in the semiconductor and integrated circuits industry, capable of creating intricate patterns on silicon wafers with up to 1000W of Inductively Coupled Plasma power. It stands out with its chlorine compatibility, offering versatile etching capabilities. The built-in chiller stage ensures controlled temperatures, protecting silicon wafers from heat damage and maintaining precision.
Related Information
1000w in ICP power, chiller stage Cl etcher
Tool Contact
Toby.Shanley-1@uts.edu.au
TOOL MAKE AND MODEL
LOCATION
Etcher, XeF2
Description
A vapour phase isotropic etching of silicon with very high etch selectivity of silicon to SiO2, SiN, photoresist, and Al.
Related Information
Tool Contact
anff@uq.edu.au
TOOL MAKE AND MODEL
LOCATION
ICP Etcher, Oxford Instruments ICP-100
Description
ICP Etcher, 3KW ICP source, 8 gasses(CHF3,SF6,O2,N2,C4F8,Ar,He) interferometric etch rate monitor, up to 150mm wafers through load lock.
Related Information
Dry Etch system, gas available for etching: SF6, CHF3, He, Ar, and O2 ""ICP Etcher, 3KW ICP source, 8 gasses, interferometric etch rate monitor, up to 150mm wafers, ICP etching Chalcogenide, Semiconductor, Photonics materials
Tool Contact
stephen.madden@anu.edu.au
TOOL MAKE AND MODEL
LOCATION
ICP Plasma Etcher, STS Multiplex
Description
Inductively coupled plasma etcher with optical end point trace and etch gases like Cl₂, BCl₃, SF₆, C₄F₈, Ar, and O₂.
Related Information
Tool Contact
glenn.walker@griffith.edu.au
TOOL MAKE AND MODEL
LOCATION
Large Plasma Asher, Alpha Plasma Q235
Description
General Plasma cleaning system
Related Information
Plasma Asher commonly used to clean materials of organics materials, and can also be used for surface treatment of materials
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
LOCATION
Microwave Ashing system, PVA Tepla
Description
The Microwave Ashing System from PVA TePla is a high-performance plasma processing tool designed for photoresist ashing, descum, wafer cleaning, and MEMS fabrication. It utilises microwave-generated plasma to achieve damage-free material removal, making it ideal for semiconductor and microelectronics applications
Related Information
Tool Contact
anff@uq.edu.au
TOOL MAKE AND MODEL
LOCATION
O2 plasma cleaner, Tergeo Benchtop
Description
The Tergeo Benchtop O₂ Plasma Cleaner is a compact, high-performance plasma system designed for surface cleaning, activation, and organic contamination removal in research, development, and low-volume manufacturing.
Related Information
Tool Contact
anff@uq.edu.au
TOOL MAKE AND MODEL
LOCATION
Plasma Cleaner, Tergeo Tabletop
Description
For surface cleaning and surface activation. Used when making a glass-PDMS or PDMS-PDMS microfluidic chip
Related Information
Tool Contact
anff@uq.edu.au
TOOL MAKE AND MODEL
LOCATION
Plasma Etching, LAM Autoetch 480
Plasma Asher
Description
Plasma etching of 6 inch wafers using a semi-isotropic dry etch process. Can produce features of 3µm.
Related Information
Utilises SF6 and O. Used to etch SiC, SiN and SiO2 and polymer resists. Plasma Asher
Tool Contact
glenn.walker@griffith.edu.au
TOOL MAKE AND MODEL
LOCATION
RIE Etching, South Bay RIE3000
O2 Plasma Asher/RIE
Description
Reactive ion etch system dedicated to O2 and Ar plasma processes
Related Information
Used primarily for resist and sample cleaning. O2 Plasma Asher/RIE
Tool Contact
rpf.queries@sydney.edu.au