Wire bonding
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Wire bonding

Wire bonding is the part of the fabrication that allows an electrical component to communicate with the outside world. A thin electrically conductive wire – typically gold, aluminium, copper or silver – is used to allow electricity to flow from contacts on the component to, or from, its packaging. There are two commonly used types of wire bonding – wedge and ball. Which one is more suitable depends on the substrate, the contact material, the bonding material, and a number of other physical factors. Bonders can be manual or automated, and some can feature pattern recognition software to help speed the bonding process up.

List of available equipment
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
F&S Bondtec ball bonder
Wire bonder
University of Western Australia WA Node
Description
Semi-automated gold wire bonding station
Related Information
Gold-Ball-Bonding for wires from 17.5 to 50 μm thick using Standard-Capillaries 16 mm to 19 mm. Motor driven Programmable Z-Axis 60mm provides repeatable results.Uses a bumping mode as well as the stitchbond mode.
Tool Contact
anff-wa@uwa.edu.au
Kulicke & Soffa 4523
Wedge bonder
NSW Node University of New South Wales
Description
Al wedge bonder
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
Kulicke & Soffa 4526 Wedge Bonder
Wedge Bonder
University of Western Australia WA Node
Description
Manual wedge bonder, simple set-up and incorporates analogue controls for ease of use. This allows rapid adjustment of individual bonding parameters.
Related Information
Ultrasonically bonding a wide range of gold or aluminium wires and ribbons from 12 - 75 micron wire through 25 x 250 micron ribbon.
Tool Contact
anff-wa@uwa.edu.au
Wedge Bonder-Kulicke & Soffa 4526
Wedge Bonder
QLD Node University of Queensland
Description
Wire bonder for power semiconductors, automotive power modules and industrial hybrids and prototypes
Related Information
Ultrasonically bond round aluminium wires from 25 to 500 microns in diameter (1-20 mils) and use the PowerRibbon® process to ultrasonically bond aluminium ribbons from 500 x 100 to 2000 x 300 microns in cross-section (20 x 4 - 80 x 12 mils).
Tool Contact
anff@uq.edu.au
Westbond 747677E
Ultrasonic/Thermosonic Gold wire bonding
ACT Node Australian National University (ANU)
Description
Wire Bonding
Related Information
Ball and Wedge bonding to gold pads
Tool Contact
horst.punzmann@anu.edu.au
Wire Bonder Ball/Deep-access Wedge
Wire bonder with pull head and general upgrades
Melbourne Centre for Nanofabrication VIC Node
Description
Deep access wire bonder suitable for wedge bonding.. Deep access wedge allows for the bonding of devices with tight and constricted geometries.
Related Information
Allows for stitch bonding as well as programmable bond maps. Uses Al-Si or gold wire, or gold ribbon.
Tool Contact
mcn-enquiries@nanomelbourne.com
Wire bonder- TPT HB16
Wedge and ball bonder
QLD Node University of Queensland
Description
Wire Bonder with motorised Z- and Y-Axis and is capable of performing both wedge and ball bonding.
Related Information
Wire materials - Gold, silver, aluminium, copper. Wire sizes 17 - 75 µm. Ribbon sizes up to 25x250 µm. Deep access wedge 16mm and ball 13mm.
Tool Contact
anff@uq.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
F&S Bondtec ball bonder
Wire bonder
QLD Node University of Queensland
Description
Semi-automated gold wire bonding station
Related Information
Gold-Ball-Bonding for wires from 17.5 to 50 μm thick using Standard-Capillaries 16 mm to 19 mm. Motor driven Programmable Z-Axis 60mm provides repeatable results.Uses a bumping mode as well as the stitchbond mode.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Kulicke & Soffa 4523
Wedge bonder
QLD Node University of Queensland
Description
Al wedge bonder
Related Information
More information to come.
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Kulicke & Soffa 4526 Wedge Bonder
Wedge Bonder
QLD Node University of Queensland
Description
Manual wedge bonder, simple set-up and incorporates analogue controls for ease of use. This allows rapid adjustment of individual bonding parameters.
Related Information
Ultrasonically bonding a wide range of gold or aluminium wires and ribbons from 12 - 75 micron wire through 25 x 250 micron ribbon.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Wedge Bonder-Kulicke & Soffa 4526
Wedge Bonder
QLD Node University of Queensland
Description
Wire bonder for power semiconductors, automotive power modules and industrial hybrids and prototypes
Related Information
Ultrasonically bond round aluminium wires from 25 to 500 microns in diameter (1-20 mils) and use the PowerRibbon® process to ultrasonically bond aluminium ribbons from 500 x 100 to 2000 x 300 microns in cross-section (20 x 4 - 80 x 12 mils).
Tool Contact
anff@uq.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Westbond 747677E
Ultrasonic/Thermosonic Gold wire bonding
QLD Node University of Queensland
Description
Wire Bonding
Related Information
Ball and Wedge bonding to gold pads
Tool Contact
horst.punzmann@anu.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Wire Bonder Ball/Deep-access Wedge
Wire bonder with pull head and general upgrades
QLD Node University of Queensland
Description
Deep access wire bonder suitable for wedge bonding.. Deep access wedge allows for the bonding of devices with tight and constricted geometries.
Related Information
Allows for stitch bonding as well as programmable bond maps. Uses Al-Si or gold wire, or gold ribbon.
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Wire bonder- TPT HB16
Wedge and ball bonder
QLD Node University of Queensland
Description
Wire Bonder with motorised Z- and Y-Axis and is capable of performing both wedge and ball bonding.
Related Information
Wire materials - Gold, silver, aluminium, copper. Wire sizes 17 - 75 µm. Ribbon sizes up to 25x250 µm. Deep access wedge 16mm and ball 13mm.
Tool Contact
anff@uq.edu.au