
Wire Bonding
Wire Bonding
Wire bonding is the part of the fabrication that allows an electrical component to communicate with the outside world. A thin electrically conductive wire – typically gold, aluminium, copper or silver – is used to allow electricity to flow from contacts on the component to, or from, its packaging. There are two commonly used types of wire bonding – wedge and ball. Which one is more suitable depends on the substrate, the contact material, the bonding material, and a number of other physical factors. Bonders can be manual or automated, and some can feature pattern recognition software to help speed the bonding process up.
List of available equipment
TOOL MAKE AND MODEL
LOCATION
Ball Bonder, TPT HB10 Thermosonic Au
ANFF NSW UNSW
Wedge bonder, Kulicke & Soffa 4523
ANFF NSW UNSW
Wedge Bonder, Kulicke & Soffa 4526
ANFF QLD UQ - AIBN
Wedge Bonder, Kulicke & Soffa 4526 Wedge Bonder
ANFF WA
Wire Bonder, Ball/Deep-access Wedge
ANFF VIC MCN
Wire bonder, F and S Bondtech 53XX-BDA
ANFF NSW UNSW
Wire Bonder, F&S Bondtec 5310
ANFF WA
Wire bonder, TPT HB100
ANFF NSW USYD
Wire bonder, TPT HB16
ANFF QLD UQ - AIBN
Wire Bonder, Westbond
ANFF NSW UTS
Wire bonder, Westbond 747677E
ANFF ACT
TOOL MAKE AND MODEL
LOCATION
Wire Bonder, F&S Bondtec 5310
Wire bonder
Description
The F&S Bondtec Ball Bonder is a high-precision semi automated wire bonding system designed for gold ball bonding in semiconductor packaging, microelectronics, and optoelectronics. It features exchangeable bond heads, allowing for flexible adaptation to various bonding processes.
Related Information
Gold-Ball-Bonding for wires from 17.5 to 50 μm thick using Standard-Capillaries 16 mm to 19 mm. Motor driven Programmable Z-Axis 60mm provides repeatable results.Uses a bumping mode as well as the stitchbond mode. Wire bonder
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
LOCATION
Ball Bonder, TPT HB10 Thermosonic Au
Description
The TPT HB10 Thermosonic Ball Bonder is a bench-top wire bonding system designed for laboratories and pilot production lines. It supports gold ball bonding and wedge bonding, offering motorised Z-axis control for precise bond placement.
Related Information
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
LOCATION
Wedge bonder, Kulicke & Soffa 4523
Wedge bonder
Description
The Kulicke & Soffa 4523 is a manual wedge bonder designed for precise wire bonding in semiconductor packaging, microwave devices, and hybrid circuits. It supports gold and aluminum wire bonding, accommodating wire diameters from 18 to 76 microns.
Related Information
More information to come. Wedge bonder
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
LOCATION
Wedge Bonder, Kulicke & Soffa 4526 Wedge Bonder
Wedge Bonder
Description
Manual wedge bonder, simple set-up and incorporates analogue controls for ease of use. This allows rapid adjustment of individual bonding parameters.
Related Information
Ultrasonically bonding a wide range of gold or aluminium wires and ribbons from 12 - 75 micron wire through 25 x 250 micron ribbon. Wedge Bonder
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
LOCATION
Wedge Bonder, Kulicke & Soffa 4526
Wedge Bonder
Description
Wire bonder for power semiconductors, automotive power modules and industrial hybrids and prototypes
Related Information
Ultrasonically bond round aluminium wires from 25 to 500 microns in diameter (1-20 mils) and use the PowerRibbon® process to ultrasonically bond aluminium ribbons from 500 x 100 to 2000 x 300 microns in cross-section (20 x 4 - 80 x 12 mils). Wedge Bonder
Tool Contact
anff@uq.edu.au
TOOL MAKE AND MODEL
LOCATION
Wire Bonder, Ball/Deep-access Wedge
Wire bonder with pull head and general upgrades
Description
Deep access wire bonder suitable for wedge bonding.. Deep access wedge allows for the bonding of devices with tight and constricted geometries.
Related Information
Allows for stitch bonding as well as programmable bond maps. Uses Al-Si or gold wire, or gold ribbon. Wire bonder with pull head and general upgrades
Tool Contact
mcn-enquiries@nanomelbourne.com
TOOL MAKE AND MODEL
LOCATION
Wire bonder, F and S Bondtech 53XX-BDA
Description
The F&S Bondtec 53XX-BDA is a manual/semi-automatic wire bonder designed for deep-access wedge bonding and ball bonding in semiconductor packaging, RF devices, and microelectronics. It supports gold and aluminum wire bonding, accommodating wire diameters from 17.5 to 75 µm.
Related Information
Tool Contact
anff@unsw.edu.au
TOOL MAKE AND MODEL
LOCATION
Wire bonder, TPT HB16
Wedge and ball bonder
Description
Wire Bonder with motorised Z- and Y-Axis and is capable of performing both wedge and ball bonding.
Related Information
Wire materials - Gold, silver, aluminium, copper. Wire sizes 17 - 75 µm. Ribbon sizes up to 25x250 µm. Deep access wedge 16mm and ball 13mm. Wedge and ball bonder
Tool Contact
anff@uq.edu.au
TOOL MAKE AND MODEL
LOCATION
Wire bonder, Westbond 747677E
Ultrasonic/Thermosonic Gold wire bonding
Description
The Westbond 747677E is a manual wire bonder designed for precision wedge and ball bonding in semiconductor packaging, hybrid circuits, and microwave applications. It supports gold and aluminum wire bonding, accommodating various wire diameters for customised interconnections.
Related Information
Ball and Wedge bonding to gold pads Ultrasonic/Thermosonic Gold wire bonding
Tool Contact
horst.punzmann@anu.edu.au